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Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows

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Abstract

In this research, the shielding effect of Ag3Sn particles on Cu6Sn5 grain boundaries in isothermal heating and cooling of multiple reflows was investigated in Sn/Cu and Sn3.5Ag/Cu solder bumps by utilizing the real-time imaging technology of Shanghai Synchrotron Radiation Facility as well as scanning electron microscope. Results show that controlled by volume diffusion growth mechanism, the value of time exponent n for Sn is much closer to 1/2 with increasing reflow cycle than for Sn3.5Ag that governed by both grain boundary and volume diffusion mechanisms in isothermal heating. Consequently, IMC increment in Sn3.5Ag is larger than in Sn due to the Cu supplement effect of J*in−b in cooling during multiple reflows. The reason for the phenomena may be the shielding effect of Ag3Sn nano particles on grain boundaries in Sn3.5Ag during multiple reflow process.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (Grant Nos.: 51571049 and 51675080) and China Postdoctoral Science Foundation (Grant Nos.: 2017M611215). The synchrotron radiation experiments were performed at the BL13W1 beam line of Shanghai Synchrotron Radiation Facility (SSRF), China.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Dalian University of Technology, Dalian, 116024, China

    Haoran Ma, Zhiyuan Liu, Jun Chen, Yunpeng Wang, Mingliang Huang, Ning Zhao & Haitao Ma

  2. School of Mechanical Engineering, Dalian University of Technology, Dalian, 116024, China

    Anil Kunwar

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  1. Haoran Ma
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  2. Anil Kunwar
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  3. Zhiyuan Liu
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  4. Jun Chen
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  5. Yunpeng Wang
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  6. Mingliang Huang
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  7. Ning Zhao
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  8. Haitao Ma
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Correspondence to Ning Zhao or Haitao Ma.

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Ma, H., Kunwar, A., Liu, Z. et al. Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows. J Mater Sci: Mater Electron 29, 4383–4390 (2018). https://doi.org/10.1007/s10854-017-8428-7

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  • DOI: https://doi.org/10.1007/s10854-017-8428-7

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