Abstract
This paper discussed about the progressive microplasma generation in planar spiral inter-digitated terminal (IDT) structure. The IDT structures (with separation between two adjacent spiral electrodes varied progressively from 30 to 33 µm) are fabricated on quartz wafer by 5 µm thick gold electroplating. The onset of microplasma is witnessed around 580 V applied bias (Electric field: ~ 193 kV/cm). Initially, the microplasma is observed nearby the central area of the spiral IDT structure. Thereafter, the microplasma started spreading out other regions and finally engulfs the whole IDT with an intense glow. Although the bias is applied continuously, the microplasma generation in the spiral IDT structure is found to be discontinuous. It seems to be due to the discharge of the energy stored in the metal-air-metal capacitor (spiral IDT) during micro-plasma generation and thus reduces the resultant electric field below the threshold of microplasma generation. When the micro-plasma stops, the voltage at the IDT capacitors is again restored to its threshold value and microplasma is being observed again.
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References
M. Khalifa, High Voltage Engineering (Marcel Dekker, New York, 1990)
E. Kuffel, W.S. Zaengl, High Voltage Engineering Fundamentals (Pergamon Press, Oxford, 1984)
N.S.J. Braithwaite, Plasma Sources Sci. Technol. 9, 517–527 (2000)
K.H. Becker, K.H. Schoenbach, J.G. Eden, J. Phys. D 39, R55–R70 (2006)
D. Mariotti, J.A. McLaughlin, P. Maguire, Plasma Sources Sci. Technol. 13, 207–212 (2004)
J. Winter, R. Brandenburg, K.D. Weltmann, Plasma Source Sci. Technol. 24, 064001 (2015)
T.A. Baginski, U.S. Patent no. 6977468 (2005)
A.J. Wagner, D. Mariotti, K.J. Yurchenko, T.K. Das, Phys. Rev. E 80, 065401 (2009)
S.O. Kim, IEEE Trans. Plasma Sci. 36, 1244–1245 (2008)
P.K. Kao, C.C. Hsu, Anal. Chem. 86, 8757–8762 (2014)
Y.B. Gianchandani, S.A. Wright, C.K. Eun, C.G. Wilson, B. Mitra, Anal. Bioanal. Chem. 395, 559–575 (2009)
T.A. Baginski, R.N. Dean, E.J. Wild, IEEE Trans. Compo. Packag. Manuf. Technol. 1, 1480–1485 (2011)
R. Brandenburg, Plasma Sources Sci. Technol. 26, 053001 (2017)
N. Shirai, Y. Onaka, S. Ibuka, K. Yasuoka, S. Ishii, Jpn. J. Appl. Phys. 46, 370–374 (2007)
D. Luo, Y. Duan, TrAC Trends Anal. Chem. 39, 254–266 (2012)
K. Taniguchi, T. Fukasawa, H. Yoshiki, Y. Horiike, Jpn. J. Appl. Phys. 42, 6584–6589 (2003)
S. Dutta, R.K. Bhan, U. Kapoor, in 2017 IEEE Conference on Intelligent Systems and Control, pp. 398–401 (2017)
J.J. Shi, M.G. Kong, Phys. Rev. Lett. 96, 105009 (2006)
P. Bruggeman, R. Brandenburg, J. Phys. D 46, 464001 (2013)
J. Choi, F. Iza, J.K. Lee, C.M. Ryu, IEEE Trans. Plasma Sci. 35, 1274–1278 (2007)
Y.T. Zhang, L. Ge, IEEE Trans. Plasma Sci. 42(10), 3321–3327 (2014)
M.J. Madau, Fundamental of Microfabrication—The Science of Miniaturization (CRC Press, London, 2002)
S. Dutta, Md Shaveta. R. Imran, R.K. Pal, Bhan, J. Mater. Sci.: Mater. Electron. 25, 3828–3832 (2014)
S. Dutta, R. Pal, P. Kumar, O.P. Hooda, J. Singh, G. Shaveta, P. Saxena, R. Datta, Chatterjee, Sens. Trans. 111, 18–24 (2009)
S. Dutta, R. Chatterjee, Mater. Sci. Eng. B 198, 74–79 (2015)
K. Shimizu, Y. Mizuno, M. Blajan, H. Yoneda, IEEE Trans. Ind. Appl. 53, 1452–1458 (2017)
S. Dutta, Md. Imran, A. Pandey, T. Saha, I. Yadav, R. Pal, K.K. Jain, R. Chatterjee, J. Mater. Sci.: Mater. Electron. 25, 382–389 (2014)
A.V. Likhanskii, M.N. Shneider, S.O. Macheret, R.B. Miles, J. Appl. Phys. 103, 053305 (2008)
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The authors acknowledge Director SSPL for his continuous support and for the permission to publish this work. The authors also acknowledge the help from Mr. Anand Kumar for the SEM images. Help from other colleagues of MEMS and IEEE groups of SSPL are also acknowledged.
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Dutta, S., Kapoor, U., Kumar, L. et al. Fabrication of spiral inter-digitated terminal (IDT) structure of electroplated gold on quartz substrate and progressive microplasma generation. J Mater Sci: Mater Electron 29, 2825–2830 (2018). https://doi.org/10.1007/s10854-017-8211-9
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DOI: https://doi.org/10.1007/s10854-017-8211-9