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Simple electrochemical preparation of nanoflake-like copper oxide on Cu-plated nickel foam for supercapacitor electrodes with high areal capacitance

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Abstract

Herein, a simple and green two-step electrochemical method was used to prepare nanoflake-like CuO\Cu microparticles on Nickel Foam (NiF) for supercapacitor applications. First, Cu microparticles were plated on NiF through a simple immersion method. Next, the Cu/NiF electrode was electrochemically oxidized in KOH solution to CuO/Cu/NiF. The effect of KOH electrolyte concentration on the electro-oxidation of Cu/NiF was also investigated. FESEM studies show that the surface morphology of CuO/Cu is highly porous, consisting of Cu interconnected microparticles on which islands of CuO have grown. The CuO/Cu/NiF electrode exhibited a high areal capacitance of 0.31 F cm−2 at a scan rate of 10 mV s−1 with excellent stability over 1000 voltammetric cycles. The results in this study show the potential application of CuO/Cu/NiF as a low-cost high-performance positive electrode in Supercapacitors.

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Acknowledgements

The authors would like to thank the University of Tehran for financial support of this work.

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Authors and Affiliations

  1. School of Chemistry, Center of Excellence in Electrochemistry, College of Science, University of Tehran, Tehran, Iran

    K. Malaie, M. R. Ganjali & P. Norouzi

  2. Biosensor Research Center, Endocrinology and Metabolism Molecular-Cellular Sciences Institute, Tehran University of Medical Sciences, Tehran, Iran

    M. R. Ganjali & P. Norouzi

  3. Department of Analytical Chemistry, School of Chemistry, College of Science, University of Tehran, Tehran, Iran

    T. Alizadeh

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  1. K. Malaie
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  2. M. R. Ganjali
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  3. T. Alizadeh
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  4. P. Norouzi
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Correspondence to M. R. Ganjali.

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Malaie, K., Ganjali, M.R., Alizadeh, T. et al. Simple electrochemical preparation of nanoflake-like copper oxide on Cu-plated nickel foam for supercapacitor electrodes with high areal capacitance. J Mater Sci: Mater Electron 28, 14631–14637 (2017). https://doi.org/10.1007/s10854-017-7327-2

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  • DOI: https://doi.org/10.1007/s10854-017-7327-2

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