Study on the microstructure and properties of low-Ag Sn–0.3Ag–0.7Cu–0.5Ga solder alloys bearing Pr
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Effect of Pr element on the wettability, microstructure, interface morphology and mechanical property of Sn–0.3Ag–0.7Cu–0.5Ga–xPr solder has been studied. The result exhibits that the wettability of solders could significantly be improved by adding an approximate amount of Pr, for the forming of well-distributed PrSn3 IMCs could serve as the sites of heterogeneous nucleation, subsequently leading to the refinement of β-Sn matrix and reducing the growth of IMCs. Therefore, the thickness of the IMC layers at the interface (Cu plate/solder) is reduced, implying that the morphology is optimized. The promotion of mechanical properties is also correlated to the refining of IMC layer.
KeywordsWettability Solder Joint Solder Alloy Cu6Sn5 Phase Maximum Shear Force
The Project was supported by the Key Laboratory of Advanced Welding Technology of Jiangsu Province, China (Foundation No. JSAWT-14-04). This work was also supported by the Fundamental Research Funds for the Central Universities and the Priority Academic Program Development of Jiangsu Higher Education Institutions (PAPD). The present work also was carried out with the support of China Postdoctoral Science Foundation (General Financial Grant 2014M550289, Special Financial Grant 2015T80548).
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