Skip to main content

Advertisement

SpringerLink
Log in

Solder material experiencing low temperature inelastic stress and random vibration loading: predicted remaining useful lifetime

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

Although there exist promising ways to avoid inelastic strains in solder joints of the second level interconnections in IC package designs, it still appears more typical than not that the peripheral joints of a package/PCB assembly experience inelastic strains. This takes place at low temperature conditions, when the deviation from the high fabrication temperature is the largest and the induced thermal stresses are the highest. On the other hand, it is well known that it is the combination of low temperatures and repetitive dynamic loading that accelerate dramatically the propagation of fatigue cracks, whether elastic or inelastic. Accordingly, a modification of the recently suggested Boltzmann–Arrhenius–Zhurkov model is developed for the evaluation of the remaining useful lifetime of the second level solder joint interconnection whose peripheral joints experience inelastic strains. The experimental basis of the approach is the highly focused and highly cost-effective failure-oriented-accelerated-testing (FOAT). The FOAT specimens are subjected in our methodology to the combined action of low temperatures (not to elevated temperatures, as in the classical Arrhenius model) and random vibrations with the given input energy spectrum. The suggested methodology is viewed as a possible, effective and attractive alternative to temperature cycling. As long as inelastic deformations take place, it is assumed that it is these deformations that determine the fatigue lifetime of the solder material, and the state of stress in the elastic mid-portion of the assembly does not have to be accounted for. The roles of the size and stiffness of this mid-portion have to be considered, however, when determining the very existence and establishing the size of the inelastic zones at the peripheral portions of the designs. The general concept is illustrated by a numerical example. Although this example is carried out for a ball-grid-array design, it is applicable to highly popular column-grid-array (CGA) and quad-flat-no-lead (QFN) designs as well. It is noteworthy that it is much easier to avoid inelastic strains in CGA and QFN structures than in the addressed BGA design. The random vibrations are considered in the developed methodology as a white noise of the given (m/s2)2/Hz—the ratio of the acceleration amplitudes squared to the vibration frequency.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

We’re sorry, something doesn't seem to be working properly.

Please try refreshing the page. If that doesn't work, please contact support so we can address the problem.

Similar content being viewed by others

References

  1. J. Lau (ed.), Solder Joint Reliability: Theory and Applications (Van Nostrand Reinhold, New York, 1990)

    Google Scholar 

  2. J.-P. Clech, F. M. Langerman, J. A. Augis, Local CTE mismatch in SM leaded packages: a potential reliability concern, in Proceedings on 40th Electronic Components and Technology Conference, Las Vegas, NE (1990)

  3. W. Engelmaier, Reliability for surface mount solder joints: physics and statistics of failure, in Proceedings on Surface Mount International, vol. 1 (San Jose, CA, 1992)

  4. H.D. Solomon, Fatigue of 60/40 solder. IEEE CHMT Trans. 9(4), 423–432 (1986)

    Google Scholar 

  5. H.U. Akay, N.H. Paydar, A. Bilgic, Fatigue life prediction for thermally loaded solder joints using a volume-weighted averaging technique. ASME J. Electron. Packag. 119, 228–235 (1997)

    Article  Google Scholar 

  6. ASTM-E2368, Standard Practice for Strain Controlled Thermomechanical Fatigue Testing (2010)

  7. A. Dasgupta, C. Oyan, D. Barker, M. Pecht, Solder cree fatigue analysis by an energy partitioning approach. ASME J. Electron. Packag. 114, 152–160 (1992)

    Article  Google Scholar 

  8. E. Suhir, Stresses in bi-metal thermostats. ASME J. Appl. Mech. 53(3), 657–660 (1986)

    Article  Google Scholar 

  9. A.Y. Kuo, Thermal stress at the edge of a bi-metallic thermostat. ASME J. Appl. Mech. 57, 585–589 (1990)

    Google Scholar 

  10. E. Suhir, Analysis of a short beam with application to solder joints: could larger stand-off heights relieve stress? Eur. J. Appl. Phys. EPJAP 71, 31301 (2015)

    Article  Google Scholar 

  11. E. Suhir, Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the ends. J. Mater. Sci. Mater. Electron. 27(6), 5563–5574 (2016)

    Article  Google Scholar 

  12. E. Suhir, R. Ghaffarian, Predicted stresses in a ball-grid-array (BGA)/column-grid-array (CGA) assembly with epoxy adhesive at its ends. J. Mater. Sci. Mater. Electron. 27(5), 9680–9688 (2016)

    Google Scholar 

  13. E. Suhir, Avoiding low-cycle fatigue in solder material using inhomogeneous column-grid-array (CGA) design. ChipScale Rev. (2016)

  14. E. Suhir, R. Ghaffarian, J. Nicolics, Could application of column-grid-array technology result in inelastic-strain-free state-of-stress in solder material? J. Mater. Sci. Mater. Electron. 26(12), 10062–10067 (2015)

    Article  Google Scholar 

  15. H.L.J. Pang, Y.P. Wang, X.Q. Shi, Z.P. Wang, Sensitivity study of temperature and strain rate dependent properties on solder joint fatigue life, in IEEUCMPT Electronic Packaging Technology Conference (1998)

  16. R. Darveaux, K. Banerji, Constitutive relations for tin-based solder joints. IEEE Trans. Compon. Hybrid Manuf. Technol. 15(6), 1013–1024 (1998)

    Article  Google Scholar 

  17. C. Yan, Q.-H. Qin, Y.-W. Mai, Nonlinear analysis of plastic ball grid array solder joints. J. Mater. Sci. Mater. Electron. 12, 667–673 (2001)

    Article  Google Scholar 

  18. X. Hao, L. Qin, D. Yang, S. Liu, Thermal-mechanical stress and fatigue failure analysis of a PBGA, in IPT (2003)

  19. P. Vianco, M.K. Neilsen, Thermal mechanical fatigue of a 56 I/O plastic quad-flat no-lead (PQFN) package, in Proceedings on SMTA International, 27 Sept–1 Oct (2015)

  20. E. Suhir, Analysis of a pre-stressed bi-material accelerated life test (ALT) specimen. Zeitschrift fur Angewandte Mathematik und Mechanik (ZAMM) 91(5), 371–385 (2011)

    Article  Google Scholar 

  21. G. Khatibi, B. Czerny, J. Magnien, M. Lederer, E. Suhir, J. Nicolics, Towards adequate qualification testing of electronic products: review and extension (EPTC, Singapore, 2014)

    Google Scholar 

  22. G. Khatibi, Alternative accelerated qualifications methods, in 4-th CORPE Annual Symposium, Reliability in Power Electronics, Aaborg, Denmark (2015)

  23. E. Suhir, S. Kang, Boltzmann–Arrhenius–Zhurkov (BAZ) model in physics-of-materials problems. Mod. Phys. Lett. B MPLB 27, 1330009 (2013)

    Article  Google Scholar 

  24. E. Suhir, L. Bechou, A. Bensoussan, Technical diagnostics in electronics: application of Bayes formula and Boltzmann–Arrhenius–Zhurkov model. Circuit Assemb. (2012)

  25. E. Suhir, A. Bensoussan, Application of multi-parametric BAZ model in aerospace optoelectronics, in 2014 IEEE Aerospace Conference, Big Sky, Montana (2014)

  26. E. Suhir, J. Nicolics, S. Yi, Probabilistic predictive modeling (PPM) of aerospace electronics (AE) reliability: prognostic-and-health-monitoring (PHM) effort using Bayes formula (BF), Boltzmann–Arrhenius–Zhurkov (BAZ) equation and beta-distribution (BD), in 2016 EuroSimE Conference, Montpelier, France (2016)

  27. E. Suhir, Probabilistic design for reliability. ChipScale Rev. 14(6) (2010)

  28. E. Suhir, When reliability is imperative, ability to quantify it is a must. IMAPS Adv. Microelectron. (2012)

  29. E. Suhir, Assuring aerospace electronics and photonics reliability: what could and should be done differently, in 2013 IEEE Aerospace Conference, Big Sky, Montana (2013)

  30. E. Suhir, Predicted reliability of aerospace electronics: application of two advanced probabilistic techniques, in 2013 IEEE Aerospace Conference, Big Sky, Montana (2013)

  31. E. Suhir, Failure-oriented-accelerated-testing (FOAT) and its role in making a viable IC package into a reliable product. Circuits Assemb. (2013)

  32. E. Suhir, Reliability physics and probabilistic design for reliability (PDfR): role, attributes, challenges, in EPTC 2014, Singapore, 5 Nov 2014 (invited)

  33. E. Suhir, A. Bensoussan, J. Nicolics, L. Bechou, Highly accelerated life testing (HALT), failure oriented accelerated testing (FOAT), and their role in making a viable device into a reliable product, in 2014 IEEE Aerospace Conference, Big Sky, Montana (2014)

  34. E. Suhir, Failure-oriented-accelerated-testing (FOAT) and its role in making a viable package into a reliable product, in SEMI-TERM 2014, San Jose, CA, 9–13 Mar 2014

  35. E. Suhir, Electronics reliability cannot be assured, if it is not quantified. ChipScale Rev. (2014)

  36. E. Suhir, A. Bensoussan, G. Khatibi, J. Nicolics, Probabilistic design for reliability in electronics and photonics: role, significance, attributes, challenges, in IRPS, Hyatt Regency Monterey Resort & Spa, Monterey, CA, USA, 19–23 Apr 2015

  37. J.H. Lau, N. Hoo, R. Horseley, J. Smetana, D. Shangguan, D. Dauksher, D. Love, I. Menis, D. Sullivan, Reliability testing and data analysis of lead-free solder joints for high-density packages. Solder. Surf. Mt. Technol. 16(2), 46–68 (2004)

    Article  Google Scholar 

  38. F. Liu, G. Meng, Random vibration reliability of BGA lead-free solder joint. Microelectron. Reliab. 54, 226–232 (2014)

    Article  Google Scholar 

  39. W. Tustin, Random Vibration and Shock Testing (Equipment Reliability Institute, Santa Barbara, CA, 2005)

    Google Scholar 

  40. P.D. Van Baren, System and method for simultaneously controlling spectrum and kurtosis of a random vibration. US Patent Office #7,426,426 B2

  41. W.H. Connon, Comments on kurtosis of military vehicle vibration data. J. Inst. Environ. Sci. (1991)

  42. A. Palmgren, Die Lebensdauer von Kuegellagern. Z. Ver. Dtsch. Ing. 68, 339–341 (1924)

    Google Scholar 

  43. M.A. Miner, Cumulative damage in fatigue. ASME J. Appl. Mech. 67, 159–164 (1945)

    Google Scholar 

  44. S. Timoshenko, D.H. Young, Theory of Structures (McGraw-Hill, New York, 1945)

    Google Scholar 

  45. S. Timoshenko, Strength of Materials (Van-Nostrand, New York, 1955)

    Google Scholar 

  46. E. Suhir, Structural Analysis in Microelectronic and Fiber Optic Systems (Van-Nostrand, New York, 1991)

    Book  Google Scholar 

  47. E. Suhir, R. Ghaffarian, J. Nicolics, Could thermal stresses in an inhomogeneous BGA/CGA system be predicted using a model for a homogeneously bonded assembly? J. Mater. Sci. Mater. Electron. 27(1), 570–579 (2016)

    Article  Google Scholar 

  48. S.N. Zhurkov, Kinetic concept of the strength of solids. Int. J. Fract. Mech. 1(4), 295–307 (1965)

    Google Scholar 

  49. L. Boltzmann, The Second Law of Thermodynamics. Populare Schriften. Essay 3, Address to a Formal Meeting of the Imperial Academy of Science, 29 May 1886

  50. K.J. Laidlor, Chemical Kinetics (Benjamin-Cummings, San Francisco, 1997)

    Google Scholar 

  51. A. Galwey, M.E. Brown, Application of the Arrhenius equation in solid state kinetics: can this be justified? Thermochim. Acta 386, 91–98 (2002)

    Article  Google Scholar 

  52. F. Bueche, Tensile strength of plastics below the glass temperature. J. Appl. Phys. 28, 784–787 (1957)

    Article  Google Scholar 

  53. E. Suhir, Mechanical reliability of flip-chip interconnections in silicon-on-silicon multichip modules, in IEEE Conference on Multichip Modules, IEEE, Santa Cruz, CA (1993)

  54. E. Suhir, Three-step concept in modeling reliability: Boltzmann–Arrhenius–Zhurkov physics-of-failure-based equation sandwiched between two statistical models. Microelectron. Reliab. (2014)

  55. E. Suhir, Applied Probability for Engineers and Scientists (McGraw-Hill, New York, 1997)

    Google Scholar 

  56. E. Suhir, Linear and nonlinear vibrations caused by periodic impulses, in AIAA/ASME/ASCE/AHS 26th Structures, Structural Dynamics and Materials Conference, Orlando, Florida (1985)

  57. E. Suhir, Statistics- and reliability-physics-related failure processes. Mod. Phys. Lett. B MPLB 28(13), 1450105 (2014)

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Portland State University, Portland, OR, USA

    E. Suhir & S. Yi

  2. ERS Co., 727 Alvina Ct., Los Altos, CA, 94024, USA

    E. Suhir

  3. Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA, USA

    R. Ghaffarian

Authors
  1. E. Suhir
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. R. Ghaffarian
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. S. Yi
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to E. Suhir.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Suhir, E., Ghaffarian, R. & Yi, S. Solder material experiencing low temperature inelastic stress and random vibration loading: predicted remaining useful lifetime. J Mater Sci: Mater Electron 28, 3585–3597 (2017). https://doi.org/10.1007/s10854-016-5960-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-016-5960-9

Keywords

Search

Navigation