Journal of Materials Science: Materials in Electronics

, Volume 27, Issue 9, pp 9423–9430 | Cite as

Board level drop test: exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact

Article

Abstract

An analytical predictive model has been developed for the evaluation of the nonlinear dynamic response of a printed-circuit-board (PCB) to the drop impact during board-level testing. The hypothesis of “heavy-and-flexible” PCB is used in the analysis: the surface-mounted-devices (SMDs) are assumed to be small enough not to affect the PCB’s flexural rigidity, but their masses have been considered and accounted for by “spreading out” the SMD total mass over the PCB surface. The analysis is restricted to the fundamental mode of vibrations, and the method of principal coordinates is used to evaluate the response. The exact solution to the nonlinear differential equation for the principal coordinate has been obtained. Another important finding is that the nonlinear amplitudes were determined even without solving the nonlinear differential equation of motion. The main objective of the analysis is to provide design guidelines for constructing a feasible experimental setup. A simply supported board is suggested as the most appropriate structure for an adequate test vehicle: the experimental data for such a board, as far as the behavior of the solder material in the second level of interconnections is concerned, can be easily and reliably interpreted and extrapolated for the practical use. The developed model enables one to predict the induced bending moments and the in-plane (membrane) forces that could be applied in the subsequent analyses to the PCB areas in the proximity of the package and its solder joint interconnections.

Keywords

PCBs Nonlinear Frequency Drop Impact Solder Material Nonlinear Dynamic Response 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. 1.
    S. Goyal, E.K. Buratynski, Methods for realistic drop testing. Int. J. Microcircuits Electron. Packag. 23(1), 45–52 (2000)Google Scholar
  2. 2.
    S.K.W. Seah, et al., Mechanical response of PCBs in portable electronic products during drop impact, EPTC, Singapore (2002)Google Scholar
  3. 3.
    Y.C. Ong, et al., Comparison of mechanical response of PCBs subjected to product level and board-level drop impact tests, EPTC (2003)Google Scholar
  4. 4.
    T.Y. Tee, et al., Novel numerical and experimental analysis of dynamic responses under board level drop test, in EuroSime Conference (2004)Google Scholar
  5. 5.
    T.C. Chai, et al., Board level drop test reliability of IC packages, ECTC (2005)Google Scholar
  6. 6.
    C.L. Yeh, Y.S. Lai, Insights into correlation between board-level drop reliability and package-level ball impact test, ECTC (2006)Google Scholar
  7. 7.
    J.-E. Luan, et al., Dynamic responses and solder joint reliability under board level drop test. in Microelectronics Reliability, Vol 47, no. 2–3, Feb–March (2007)Google Scholar
  8. 8.
    T.T. Matilla, et al., Board-level reliability of lead-free solder under mechanical shock and vibration loads, in Dynamic Response of Electronic and Photonic Systems to Shocks and Vibrations, eds. by E. Suhir, D. Steinberg, T. Yi (Wiley, New York, 2011)Google Scholar
  9. 9.
    R. Ghaffarian, Reliability of printed circuit boards, Chapter 60 in Printed Circuit Handbook, 7th ed., ed. by C.F. Coombs (McGraw-Hill, New York, 2016)Google Scholar
  10. 10.
    Y.Q. Wang, Modeling and simulation of PCB drop test, EPTC (2003)Google Scholar
  11. 11.
    J.E. Luan, T.Y. Tee, E. Pek, C.T. Lim, Z.W. Zhong, Modal analysis and dynamic responses of board level drop test, EPTC (2003)Google Scholar
  12. 12.
    T.Y. Tee, H.S. Ng, C.T. Lim, E. Pek, Z.W. Zhong, Board level drop tests and simulation of TFBGA packages for telecommunication applications, ECTC (2003)Google Scholar
  13. 13.
    L.B. Tan, Board level solder joint failure by static and dynamic loads, EPTC (2003)Google Scholar
  14. 14.
    T.Y. Tee, H.S. Ng, Z.W. Zhong, Design for enhanced solder joint reliability of integrated passive device under board level drop test and thermal cycling test, EPTC (2003)Google Scholar
  15. 15.
    J.E. Luan, T.Y. Tee, Effect of impact pulse on dynamic responses and solder joint reliability of TFBGA packages during board level drop test, in EMAP Conference, Malaysia, Dec. 2004Google Scholar
  16. 16.
    T.Y. Tee, J.E. Luan, E. Pek, C.T. Lim, Z.W. Zhong, Novel numerical and experimental analysis of dynamic responses under board level drop test, EuroSime Conference (2004)Google Scholar
  17. 17.
    T.C. Chiu, et al, Effect of thermal aging on board level drop reliability for Pb-free BGA packages, ECTC (2004)Google Scholar
  18. 18.
    T.C. Chai, et al., Board level drop test reliability of IC packages, ECTC (2005)Google Scholar
  19. 19.
    C.L. Yeh, Y.S. Lai, Insights into correlation between board-level drop reliability and package-level ball impact test, ECTC (2006)Google Scholar
  20. 20.
    J.-E. Luan, T.-Y. Tee, E. Pek, C.-T. Lim, Z. Zhong, Dynamic responses and solder joint reliability under board level drop test, in Microelectronics Reliability, Vol. 47, no. 2–3, Feb–March (2007)Google Scholar
  21. 21.
    T.T. Matilla, P. Marjamali, J. Kivilahti, Board-level reliability of lead-free solder under mechanical shock and vibration loads, in Dynamic Response of Electronic and Photonic Systems to Shocks and Vibrations, eds. by E. Suhir, D. Steinberg, T. Yi (Wiley, New York, 2011)Google Scholar
  22. 22.
    F. Song, S.W.R. Lee, K. Newman, R. Sykes, S. Clark, Correlation between package level high-speed solder ball shear/pull and board-level mechanical drop tests with brittle fracture failure mode, strength and energy, IbidGoogle Scholar
  23. 23.
    R. Ghaffarian, Reliability of printed circuit boards, Chapter 60 in Printed Circuit Handbook, 7th ed., ed. by C.F. Coombs (McGraw-Hill, New York, 2016)Google Scholar
  24. 24.
    S.P. Timoshenko, J.M. Gere, Theory of elastic stability, 2nd edn. (McGraw-Hill, New York, 1988)Google Scholar
  25. 25.
    E. Suhir, Structural analysis in microelectronics and fiber optics, Van-Nostrand (1997)Google Scholar
  26. 26.
    L.A. Pars, A Treatise of Analytical Dynamics (Heinemann, London, 1965)Google Scholar
  27. 27.
    I.N. Sneddon, Special Functions of Mathematical Physics and Chemistry, 3rd edn. (Longman, New York, 1980)Google Scholar
  28. 28.
    E. Suhir, M. Vujosevic, T. Reinikainen, Nonlinear dynamic response of a “flexible-and-heavy” printed circuit board (PCB) to an impact load applied to its support contour. J. Appl. Phys. D. 42(4) (2009)Google Scholar

Copyright information

© Springer Science+Business Media New York 2016

Authors and Affiliations

  1. 1.Portland State UniversityPortlandUSA
  2. 2.ERS Co.Los AltosUSA
  3. 3.Jet Propulsion LaboratoryCalifornia Institute of TechnologyPasadenaUSA

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