Abstract
Because of the fabricability of polymer and excellent dielectric properties of ceramics, ceramic-polymer composites have been investigated widely for embedded capacitors which can improve electric performance greatly. In order to obtain further application of composite, the embedded capacitors with three-layer sandwich structure containing the BaTiO3/epoxy composites as dielectric layer and copper foil as electrodes were fabricated. The dielectric properties are improved by preventing the defect in dielectric layer through lamination process. Our results show that the capacitors exhibit high dielectric permittivity (ε = 20), low dielectric loss (0.01) at 103 Hz from 40 to 100 °C and high breakdown strength (24 kV/mm), which indicate that the lamination is a promising process for embedded capacitor fabrication and BaTiO3/epoxy composites have potential for high-performance embedded capacitors application in field of microelectronics.
Similar content being viewed by others
References
S.-D. Cho, K.-W. Jang, J.-G. Hyun, S. Lee, K.-W. Paik, H. Kim, J.-H. Kim, IEEE Trans. Electron. Packag. Manuf. 28(4), 297 (2005)
Z.-M. Dang, J.-K. Yuan, J.-W. Zha, T. Zhou, S.-T. Li, H. Guo-Hua, Prog. Mater Sci. 57(4), 660 (2012)
L.J. Golonka, K.-J. Wolter, A. Dziedzic, J. Kita, L. Rebenklau, Presented at the Electronics Technology: Concurrent Engineering in Electronic Packaging, 2001. 24th International Spring Seminar on, 2001 (unpublished)
K.-W. Jang, K.-W. Paik, J. Appl. Polym. Sci. 110(2), 798 (2008)
S.-D. Cho, J.-Y. Lee, J.-G. Hyun, K.-W. Paik, Mater. Sci. Eng. B 110(3), 233 (2004)
Y. Shen, Y. Lin, M. Li, C.-W. Nan, Adv. Mater. 19(10), 1418 (2007)
P. Kim, S.C. Jones, P.J. Hotchkiss, J.N. Haddock, B. Kippelen, S.R. Marder, J.W. Perry, Adv. Mater. 19(7), 1001 (2007)
D.M. Stubbs, S.H. Pulko, A.J. Wilkinson, B. Wilson, F. Christiaens, K. Allaert, Microelectron. Int. 17(2), 7 (2000)
S.-H. Park, J.-I. Ryu, J.C. Kim, N.K. Kang, J.C. Park, Y.-H. Kim, Presented at the Electronic Components and Technology Conference (ECTC), 2010 Proceedings 60th, 2010 (unpublished)
L. Jiongxin, C.P. Wong, IEEE Trans. Dielectr. Electr. Insul. 15(5), 1322 (2008)
J.A. Andresakis, E.C. Skorupski, S. Zimmerman, G. Smith, Google Patents (2003)
N.G. Devaraju, B.I. Lee, J. Appl. Polym. Sci. 99(6), 3018 (2006)
A. Takahashi, M.-a. Kakimoto, T.-a. Tsurumi, J. Hao, L. Li, R. Kikuchi, T. Miwa, T. Oono, S. Yamada, J. Photopolym. Sci. Technol. 18(2), 297 (2005)
S. Lee, J.-G. Hyun, H. Kim, K.-W. Paik, A. Packaging, IEEE Trans. 30(3), 428 (2007)
Z.-M. Dang, Yu. Yan-Fei, X. Hai-Ping, J. Bai, Compos. Sci. Technol. 68(1), 171 (2008)
S. Ogitani, S.A. Bidstrup-Allen, P.A. Kohl, IEEE Trans. Adv. Packag. 23(2), 313 (2000)
Z.-M. Dang, H.-Y. Wang, X. Hai-Ping, Appl. Phys. Lett. 89(11), 2902 (2006)
B. Wei, Q. Chang, C. Bao, L. Dai, G. Zhang, W. Fuping, Colloids Surf. A 434, 276 (2013)
J. Hong, D. Fang, Appl. Phys. Lett. 92(1), 12906 (2008)
T. Zhou, J. Zha, R. Cui, B. Fan, J. Yuan, Z. Dang, Appl. Mater. Interfaces 3, 2184–2188 (2011)
M.N. Almadhoun, U.S. Bhansali, H.N. Alshareef, J. Mater. Chem. 22, 11196 (2012)
R. Asiaie, W. Zhu, S.A. Akbar, P.K. Dutta, Chem. Mater. 8, 226–234 (1996)
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Bai, X. Dielectric properties of BaTiO3/epoxy composites by lamination process for embedded capacitor application. J Mater Sci: Mater Electron 27, 8996–9001 (2016). https://doi.org/10.1007/s10854-016-4931-5
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-016-4931-5