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Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data?

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Abstract

A simple and physically meaningful analytical predictive model is suggested to estimate the ultimate drop height in drop tests from the shear-off test data. The incentive for such an effort is due to the fact that shear-off tests are much easier to design, organize and conduct than drop tests. The analysis is limited to elastic stresses. The general concept is illustrated by a numerical example.

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Author information

Authors and Affiliations

  1. ECE and MME Departments, Portland State University, P.O. Box 751, Portland, OR, 97207-0751, USA

    Ephraim Suhir, James E. Morris, Liang Wang & Sung Yi

Authors
  1. Ephraim Suhir
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  2. James E. Morris
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  3. Liang Wang
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  4. Sung Yi
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Correspondence to Ephraim Suhir.

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Suhir, E., Morris, J.E., Wang, L. et al. Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data?. J Mater Sci: Mater Electron 27, 6697–6702 (2016). https://doi.org/10.1007/s10854-016-4617-z

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  • DOI: https://doi.org/10.1007/s10854-016-4617-z

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