Skip to main content

Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data?

Journal of Materials Science: Materials in Electronics volume 27, pages 6697–6702 (2016)Cite this article

Abstract

A simple and physically meaningful analytical predictive model is suggested to estimate the ultimate drop height in drop tests from the shear-off test data. The incentive for such an effort is due to the fact that shear-off tests are much easier to design, organize and conduct than drop tests. The analysis is limited to elastic stresses. The general concept is illustrated by a numerical example.

This is a preview of subscription content, access via your institution.

Access options

Buy single article

Instant access to the full article PDF.

39,95 €

Price includes VAT (Finland)

Fig. 1
Fig. 2

References

  1. E. Suhir, How to Make a Device into a Product: Accelerated Life Testing It’s Role, Attributes, Challenges, Pitfalls, and Interaction with Qualification Testing, in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, ed. by E. Suhir, C.P. Wong, Y.C. Lee (Springer, Berlin, 2008)

    Google Scholar 

  2. M. Dušek, J. Nottay, C. Hunt, in The Use of Shear Testing and Thermal Cycling for Assessment of Solder Joint Reliability. NPL Report CMMT(A)268 (2000)

  3. E. Suhir, Dynamic Response of Micro-Electronic Systems to Shocks and Vibrations: Review and Extension, in Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, ed. by E. Suhir, C.P. Wong, Y.C. Lee (Springer, Berlin, 2008)

    Google Scholar 

  4. E. Suhir, D. Steinberg, T. Yi (eds.), Dynamic Response of Electronic and Photonic Systems to Shocks and Vibrations (Wiley, Hoboken, 2011)

    Google Scholar 

  5. E.Suhir, in Could Shock Tests Adequately Mimic Drop Test Conditions? IEEE ECTC Conference Proceedings, San-Diego, CA, USA, May 28–31 (2002)

  6. E. Suhir, Stresses in bi-metal thermostats. ASME J. Appl. Mech. 53(3), 657–660 (1986)

    Article  Google Scholar 

  7. E. Suhir, Structural Analysis in Microelectronic and Fiber-Optic Systems (Van-Nostrand Reinhold, New York, 1998)

    Google Scholar 

  8. E. Suhir, Applied Probability for Engineers and Scientists (McGraw-Hill, New York, 1997)

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. ECE and MME Departments, Portland State University, P.O. Box 751, Portland, OR, 97207-0751, USA

    Ephraim Suhir, James E. Morris, Liang Wang & Sung Yi

Authors
  1. Ephraim Suhir
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. James E. Morris
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Liang Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Sung Yi
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Ephraim Suhir.

Rights and permissions

Reprints and Permissions

About this article

Verify currency and authenticity via CrossMark

Cite this article

Suhir, E., Morris, J.E., Wang, L. et al. Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data?. J Mater Sci: Mater Electron 27, 6697–6702 (2016). https://doi.org/10.1007/s10854-016-4617-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-016-4617-z

Keywords

  • Interfacial Shearing Stress
  • Dynamic Strength
  • Bonding Layer
  • Drop Height
  • Bonding Material