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Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design

  • E. Suhir
  • R. Ghaffarian
  • J. Nicolics
Article

Abstract

There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses in a bow-free assembly could be, however, rather high, considerably higher than in an assembly, whose bow is not restricted. The simplest and trivial case of a bow-free assembly is a tri-component body, in which the inner component is sandwiched between two identical outer components (“mirror” structure), is addressed in our analysis, and a simple and physically meaningful analytical stress model is suggested. It is concluded that if acceptable stresses (below yield stress of the solder material) are achievable, a mirror (bow-free, temperature-change-insensitive) design should be preferred, because it results in an operationally stable performance of the system.

Keywords

Inelastic Strain Interfacial Shearing Stress Bonding Layer Solder Material Assembly Component 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science+Business Media New York 2015

Authors and Affiliations

  1. 1.Portland State UniversityPortlandUSA
  2. 2.Technische Universität WienViennaAustria
  3. 3.Ariel UniversityArielIsrael
  4. 4.ERS Co. LLCLos AltosUSA
  5. 5.Jet Propulsion LaboratoryCalifornia Institute of TechnologyPasadenaUSA
  6. 6.Department of Applied Electronic Materials, Institute of Sensor and Actuator SystemsTechnische Universität WienViennaAustria

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