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Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints

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Abstract

The solderability of the Sn58Bi (SnBi)-nano Cu solder pastes and the microstructure of the solder joints were investigated. Experimental results indicated that the addition of the nano Cu particles in the SnBi solder paste shows limited effect on the solidus. The liquidus of the SnBi-3nano Cu solder paste was 1 °C higher than the SnBi solder paste. Solid Cu6Sn5 intermetallic particles formed in the SnBi-3nano Cu solder paste during the heating process. The Cu6Sn5 intermetallic particles decreased the mobility and wettability of the molten solder. Meanwhile, the Cu6Sn5 nano particles worked as nucleation sites for the formation of Bi grains and Sn–Bi eutectic phase during the cooling process and led to the grain refinement of the solder bulk. The SnBi-1nano Cu solder paste showed the smallest grain size in this research. Additionally, the SnBi-3nano Cu/Cu solder joint showed a eutectic microstructure of Sn–Bi system at the center of the solder bulk but a hypereutectic microstructure with polygon Bi grains near the margin in the solder bulk.

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Acknowledgments

Thanks to the support of National Natural Science Foundation of China (51174069), Research and Scientific Foundation of Heilongjiang Education Department (No. 12541112), and University Nursing Program for Young Scholars with Creative Talents in Heilongjiang Province (UNPYSCT-2015042).

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Authors and Affiliations

  1. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, People’s Republic of China

    Yang Liu, Hao Zhang & Fenglian Sun

Authors
  1. Yang Liu
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  2. Hao Zhang
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  3. Fenglian Sun
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Correspondence to Yang Liu.

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Liu, Y., Zhang, H. & Sun, F. Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints. J Mater Sci: Mater Electron 27, 2235–2241 (2016). https://doi.org/10.1007/s10854-015-4016-x

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  • DOI: https://doi.org/10.1007/s10854-015-4016-x

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