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Influence of B2O3–SiO2–ZnO–BaO glass ratio and sintering temperature on the microstructure and property of copper thick film for low temperature co-fired ceramic

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Abstract

In this study, B2O3–SiO2–ZnO–BaO (BSZB) glass-coated copper particles were prepared by sol–gel process for use in copper pastes. The pastes with different ratio of BSZB glass were sintered at temperatures ranging from 850 to 910 °C with low temperature co-fired ceramic (LTCC) substrate. When pastes prepared from 1 wt% glass-coated copper powder were sintered at 910 °C, both a dense copper film and a dense LTCC structure were obtained. At this condition, the film had a thickness of approximately 15 μm and a sheet resistance of 1.9 mΩ/□, and a good bonding behavior between copper film and LTCC substrate was also observed.

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Authors and Affiliations

  1. Key Laboratory of Advanced Ceramics and Machining Technology, Ministry of Education, School of Materials Science and Engineering of Tianjin University, Tianjin, 300072, People’s Republic of China

    Jun Chen, De’an Yang, Tong Zhai, Bingqiang Gui & Qi Wang

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  1. Jun Chen
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  2. De’an Yang
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  3. Tong Zhai
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  4. Bingqiang Gui
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  5. Qi Wang
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Correspondence to De’an Yang.

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Chen, J., Yang, D., Zhai, T. et al. Influence of B2O3–SiO2–ZnO–BaO glass ratio and sintering temperature on the microstructure and property of copper thick film for low temperature co-fired ceramic. J Mater Sci: Mater Electron 27, 1929–1937 (2016). https://doi.org/10.1007/s10854-015-3975-2

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  • DOI: https://doi.org/10.1007/s10854-015-3975-2

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