Abstract
Single-size 400 nm-SiO2 and multi-size 1 and 5 μm-SiO2 were used as fillers in epoxy matrix. The fillers with the larger particle size and multi-size SiO2 particles mixing is beneficial to lower the viscosity and increase the filler loading. Among the composites, the 60 wt% 5 μm-SiO2 epoxy composite has the best properties with both low coefficients of thermal expansion (CTE) of 28.8 ppm/°C and low viscosity of ~50 Pa s, which shows its capability to achieve the required low CTE and viscosity values in the electronic packaging. Different theoretical proposals were used to estimate the CTE. Maxwell–Garnett equation fits the experimental data well. In addition, the mixture law and Bruggeman effective medium theory offer the upper and lower limits to the CTE.
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Acknowledgments
This work was financially supported by the National Basic Research Program of China (973 Program, 2015CB057206), Guangdong Innovative Research Team Program (Nos. 2011D052 and KYPT20121228160843692), Shenzhen Electronic Packaging Materials Engineering Laboratory (ZDSYS20140509174237196), Shenzhen basic research plan (JSGG20150512145714246 and JCYJ20140610152828685).
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Li, G., Zhang, W., Zhu, P. et al. Improvements in thermo-mechanical and rheological properties of SiO2/epoxy composites using different types of SiO2 . J Mater Sci: Mater Electron 27, 503–511 (2016). https://doi.org/10.1007/s10854-015-3781-x
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DOI: https://doi.org/10.1007/s10854-015-3781-x