Skip to main content
Log in

Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The relationship between Ce content/CeSn3 sizes and the whiskers growth is newly reported systematically. The whiskers growth can be observed in the surface of bulk CeSn3 particles, the rate of whisker growth was significantly slowed with Ce content lower than 0.1 wt%. At higher concentration of Ce, whisker growth rate becomes higher and noticeable. It is thought that the higher Ce chemical potential for oxidation provides a path for the mechanism of whisker growth. With all the other benefits of Ce addition, the potential to promote whisker growth indicate that only dilute concentration of Ce can be tolerated in SnAgCu alloys without whiskering effect. The results demonstrated that the trace amount of Ce can be utilized as additive into SnAgCu solder in microelectronic industry.

This is a preview of subscription content, log in via an institution to check access.

Access this article

We’re sorry, something doesn't seem to be working properly.

Please try refreshing the page. If that doesn't work, please contact support so we can address the problem.

Fig. 1
Fig. 2
Fig. 3
Fig. 4

Similar content being viewed by others

References

  1. M.M. Billah, K.M. Shorowordi, A. Sharif, Effect of micro size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties. J. Alloy. Compd. 585, 32–39 (2014)

    Article  Google Scholar 

  2. A.K. Gain, Y.C. Chan, Growth mechanism of intermetallic compounds and damping properties of Sn–Ag–Cu-1 wt% nano-ZrO2 composite solders. Microelectron. Reliab. (2014). doi:10.1016/j.microrel.2014.01.026

    Google Scholar 

  3. L.L. Gao, S.B. Xue, L. Zhang, Z. Sheng, F. Ji, W. Dai, S.L. Yu, Effect of alloying elements on properties and microstructures of SnAgCu solders. Microelectron. Eng. 87(11), 2025–2034 (2010)

    Article  Google Scholar 

  4. C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Properties of lead-free solder alloy with rare earth element additions. Mater. Sci. Eng. R 44(1), 1–44 (2004)

    Article  Google Scholar 

  5. L. Zhang, X.Y. Fan, Y.H. Guo, C.W. He, Properties enhancement of SnAgCu solders containing rare earth Yb. Mater. Des. 57, 646–651 (2014)

    Article  Google Scholar 

  6. D.Q. Yu, J. Zhao, L. Wang, Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements. J. Alloy. Compd. 376(1–2), 170–175 (2004)

    Article  Google Scholar 

  7. L. Zhang, J.G. Han, Y.H. Guo, C.W. He, Effect of rare earth Ce on the fatigue life of SnAgCu solder joints in WLCSP device using FEM and experiments. Mater. Sci. Eng. A 597, 219–224 (2014)

    Article  Google Scholar 

  8. L.L. Gao, Effect of Pr and/or Nd on the Microstructures and Properties of SnAgCu Solder (Nanjing University of Aeronautics and Astronautics, Nanjing, 2012)

    Google Scholar 

  9. C.C. Jain, C.L. Chen, H.J. Lai, T.H. Chuang, The inhibition of tin whiskers on the surface of Sn-8Zn-3Bi-0.5Ce solders. J. Mater. Eng. Perform. 20(6), 1043–1048 (2011)

    Article  Google Scholar 

  10. B. Jiang, A.P. Xian, Spontaneous growth of tin whiskers on tin-rare-earth alloys. Philos. Mag. Lett. 87(9), 657–662 (2007)

    Article  Google Scholar 

  11. T.H. Chuang, Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints. Scr. Mater. 55(11), 983–986 (2006)

    Article  Google Scholar 

  12. L. Zhang, Study on Reliability of SnAgCu Based Lead-Free Soldered Joint and Related Theory (Nanjing University of Aeronautics and Astronautics, Nanjing, 2011)

    Google Scholar 

  13. K.N. Tu, J.C.M. Li, Spontaneous whisker growth on lead-free solder finishes. Mater. Sci. Eng. A 409(1–2), 131–139 (2005)

    Article  Google Scholar 

  14. M.A. Dudek, N. Chawla, Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders. Acta Mater. 57(15), 4588–4599 (2009)

    Article  Google Scholar 

  15. P. Xue, S.B. Xue, Y.F. Shen, H. Zhu, Inhibiting the growth of Sn whisker in Sn–9Zn lead-free solder by Nd and Ga. J. Mater. Sci. Mater. Electron. 25(6), 2671–2675 (2014)

    Article  Google Scholar 

Download references

Acknowledgments

The present work was carried out with the support of the Natural Science Foundation of China (51475220); the Natural Science Foundation of Jiangsu Province (BK2012144); the Natural Science Foundation of the Higher Education Institutions of Jiangsu Province (12KJB460005); the Jiangsu University of Science and Technology: Provincial Key Lab of Advanced Welding Technology Foundation (JSAWS-11-03) and the Jiangsu Normal University Foundation (11XLR16).

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Liang Zhang.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Zhang, L., Sun, L., Han, Jg. et al. Sizes effect of CeSn3 on the whiskers growth of SnAgCuCe solder joints in electronic packaging. J Mater Sci: Mater Electron 26, 6194–6197 (2015). https://doi.org/10.1007/s10854-015-3202-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-015-3202-1

Keywords

Navigation