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Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

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Abstract

In this paper, the formation and evolution characteristics of the intermetallic compounds (IMCs) in SAC305/Ag/Cu and SAC0705-3.5Bi-0.05Ni/Ag/Cu solder during reflow and 150 °C isothermal aging are investigated. Experimental results indicate that Ag3Sn forms as soon as the SAC305/Ag/Cu solder spheres wetted to the substrates. With increased soldering time, the Ag layer on a Cu substrate dissolved into the molten SAC305 solder and the interfacial IMC consisted of Cu6Sn5. The Ag layers show a faster dissolution rate in SAC0705-3.5Bi-0.05Ni/Ag/Cu than in SAC305/Ag/Cu, which is attributed to a larger concentration gradient of Ag for SAC0705-3.5Bi-0.05Ni/Ag/Cu. The formation and coarsening of a Cu3Sn layer between Cu6Sn5 and the Cu substrate caused the formation of Kirkendall voids and delamination during aging in the SAC305/Ag/Cu. A small addition of Ni in the solder significantly suppressed the formation of a Cu3Sn layer in the SAC0705-3.5Bi-0.05Ni/Ag/Cu, resulting in fewer voids in the soldering interface.

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Acknowledgments

The authors would like to thank the Chinese State Key Laboratory of Solid State Lighting for providing the financial and equipment support. Thanks to research and scientific foundation of Heilongjiang education department (No. 12541112) and College Students’ innovative experiment project of Heilongjiang province (No. 201310214035).

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Authors and Affiliations

  1. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, People’s Republic of China

    Yang Liu, Honglin Zhang & Fenglian Sun

  2. Beijing Research Centre, Delft University of Technology, Beijing, 100083, People’s Republic of China

    Yang Liu & Cadmus A. Yuan

  3. Institute of Semiconductors, Chinese Academy of Sciences, Beijing, 100083, People’s Republic of China

    Cadmus A. Yuan & Guoqi Zhang

  4. State Key Laboratory of Solid State Lighting, Changzhou, 213161, People’s Republic of China

    Yang Liu, Liangliang Luo & Cadmus A. Yuan

  5. DIMES Center for SSL Technologies, Delft University of Technology, 2628CT, Delft, Netherlands

    Joost Meerwijk & Guoqi Zhang

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  1. Yang Liu
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Correspondence to Yang Liu.

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Liu, Y., Meerwijk, J., Luo, L. et al. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging. J Mater Sci: Mater Electron 25, 4954–4959 (2014). https://doi.org/10.1007/s10854-014-2257-8

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  • DOI: https://doi.org/10.1007/s10854-014-2257-8

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