Skip to main content
SpringerLink
Log in

Microstructure and thermal expansion behavior of spray-formed Al–27Si alloy used for electronic packaging

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The hypereutectic Al–27Si (mass fraction) alloys are prepared by spray deposition and extrusion. The effect of thermal aging process on the coefficient of thermal expansion (CTE) and microstructure of the Al–27Si alloys are investigated. The results show that the distribution of Si particles in α-Al matrix is uniform, and the primary Si phase grows gradually during the process of thermal aging. The CTE between room temperature to 100 °C increases gradually with the ascending of aging temperature, attributed to the relaxation of residual thermal stress and the coarsening of primary Si phases in the alloys. On the other hand, the CTE increases linearly as the cycling temperature increases up to 500 °C, and the measured values are in good agreement with the Kerner model.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

Similar content being viewed by others

References

  1. K. Yu, S.J. Li, L.S. Chen, W.S. Zhao, P.F. Li, Trans. Nonferrous Met. Soc. China 22, 1412 (2012)

    Article  Google Scholar 

  2. Z.L. Yang, X.B. He, L.G. Wang, R.J. Liu, H.F. Hu, L.M. Wang, X.H. Qu, J. Eur. Ceram. Soc. 34, 1139 (2014)

    Article  Google Scholar 

  3. Y.X. Li, J.Y. Liu, W.S. Wang, G.Q. Liu, Trans. Nonferrous Met. Soc. China 23, 970 (2013)

    Article  Google Scholar 

  4. R. Arpon, J.M. Molina, R.A. Saravanan, C.G. Cordovilla, E. Louis, J. Narciso, Acta Mater. 51, 3145 (2003)

    Article  Google Scholar 

  5. S.C. Hogg, A. Lambourne, A. Ogilvy, P.S. Grant, Scripta Mater. 55, 111 (2006)

    Article  Google Scholar 

  6. C.X. Wang, F.X. Yu, D.Z. Zhao, X. Zhao, L. Zuo, Mater. Sci. Eng. A 577, 73 (2013)

    Article  Google Scholar 

  7. Y.B. Zhang, Y.P. Lu, J.C. Jie, Y. Fu, D.S. Zhong, T.J. Li, Nonferrous Met. Soc. China 23, 3242 (2013)

    Article  Google Scholar 

  8. H.E. Hu, X.Y. Wang, L. Deng, Mater. Sci. Eng. A 576, 45 (2013)

    Article  Google Scholar 

  9. C.H. Chiang, C.Y.A. Tsao, Mater. Sci. Eng. A 396, 263 (2005)

    Article  Google Scholar 

  10. P.S. Grant, Mater. Trans. 38A, 1520 (2007)

    Article  Google Scholar 

  11. C. Cui, A. Schulz, K. Schimanski, H.W. Zoch, J. Mater. Proc. Technol. 209, 5220 (2009)

    Article  Google Scholar 

  12. T. Huber, H.P. Degischer, G. Lefranc, T. Schmitt, Compos. Sci. Technol. 66, 2206 (2006)

    Article  Google Scholar 

  13. C. Xue, J.K. Yu, X.M. Zhu, Mater. Des. 32, 4225 (2011)

    Article  Google Scholar 

  14. E. Kerner, Proc. Phys. Soc. B 69, 808 (1956)

    Article  Google Scholar 

  15. R. Schapery, J. Comp. Mater. 2(3), 380 (1968)

    Article  Google Scholar 

  16. P. Turner, J. Res. Natl. Bur. Stand. 37, 239 (1946)

    Article  Google Scholar 

  17. Z. Hashin, S. Shtrikman, J. Mech. Phys. Solids 11, 127 (1963)

    Article  Google Scholar 

  18. N. Chen, H.X. Zhang, M.Y. Gu, Y.P. Jin, J. Mater. Proc. Technol. 209, 1471 (2009)

    Article  Google Scholar 

  19. T.H. Nam, G. Requena, P. Degischer, Compos. Part A 39, 856 (2008)

    Article  Google Scholar 

Download references

Acknowledgments

This work was financially supported by “Ministry of Science and Technology of China (JPPT-125-GH-039)”.

Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Central South University, Changsha, 410083, China

    Xuewei Zhu, Richu Wang, Chaoqun Peng, Wenshui Liu & Jian Peng

Authors
  1. Xuewei Zhu
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Richu Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Chaoqun Peng
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Wenshui Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Jian Peng
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Richu Wang.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Zhu, X., Wang, R., Peng, C. et al. Microstructure and thermal expansion behavior of spray-formed Al–27Si alloy used for electronic packaging. J Mater Sci: Mater Electron 25, 4889–4895 (2014). https://doi.org/10.1007/s10854-014-2249-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-2249-8

Keywords

Search

Navigation