Skip to main content
SpringerLink
Log in

Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

This paper investigates the influence of diffusion layer (solder layer) thickness (δ) on interface diffusion in both thermal aging and electro-thermal coupling aging. The different δ (δ = 60, 120 and 240 μm) of Cu/Sn–3.0Ag–0.5Cu (SAC305)/Cu butt solder joints are used. The results indicate that the geometrical size (solder layer thickness) of solder joint has significant effect on element diffusion behavior. The diffusion coefficient, time exponent, element concentrations and diffusion flux are greatly dependent upon δ. The effects of δ on the interface diffusion is different between thermal aging and electro-thermal coupling aging, due to driving force for diffusion is different. During thermal aging, concentration gradient is the main driving force of diffusion, and diffusion coefficient, time exponent and diffusion flux are relatively low for a thin solder layer. However, under electro-thermal coupling condition, the electron wind force provides the dominating driving force for diffusion, and diffusion coefficient and diffusion flux of thin δ are significantly larger than the thick ones. The Cu concentration of the area near interface is relatively high for a thin solder layer in both tests. Under the same experimental temperature, the effects of δ on the electro-thermal coupling aging are more obvious than thermal aging.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  1. H. He, G. Xu, F. Guo, J. Mater. Sci. 45(2), 334 (2010)

    Article  Google Scholar 

  2. E.C.C. Yeh, W.J. Choi, K.N. Tu, P. Elenius, B. Haluk, J. Appl. Phys. Lett. 80(4), 580 (2002)

    Article  Google Scholar 

  3. J.H. Ke, T.L. Yang, C.R. Kao, J. Acta. Mater. 59(6), 246 (2011)

    Article  Google Scholar 

  4. J.H. Ke, H.Y. Chuang, W.L. Shih, C.R. Kao, J. Acta. Mater. 60(5), 2082 (2012)

    Article  Google Scholar 

  5. Y.W. Lin, J.H. Ke, H.Y. Chuang, Y.S. Lai, C.R. Kao, J. Appl. Phys. 107(7), 073516 (2010)

    Article  Google Scholar 

  6. Y. Yao, M. Leon, M.E. Keer, J. Appl. Phys. 105(6), 063710 (2009)

    Article  Google Scholar 

  7. C.K. Wong, J.H.L. Pang, J.W. Tew, B.K. Lok, J. Microelectron. Reliab. 48(4), 611 (2008)

    Article  Google Scholar 

  8. C.C. Chang, Y.W. Lin, Y.W. Wang, J. Alloys. Compd. 492(1–2, 4), 99 (2010)

  9. W.K. Choi, S.K. Kang, D.Y. Shih, J. Electron. Mater. 31(11), 1283 (2002)

    Article  Google Scholar 

  10. A. Ourdjini, M.A.A. Hanim, S.F.J. Koh, International electronic manufacturing technology (IEEE Inc, Petaling Jaya, 2006), p. 437

    Google Scholar 

  11. C.E. Ho, S.C. Yang, C.R. Kao, J. Mater. Sci.: Mater. Electron. 18(1), 147 (2007)

    Google Scholar 

  12. J.H. Lee, G.T. Lim, Y.B. 58th Park, Electronic components and technology conference (IEEE Inc, Lake Buena Vista, 2008), p. 2030

  13. N. Tunca, G.W. Delamore, R.W. Smith, J. Metall. Trans. A 21(11), 2919 (1990)

    Article  Google Scholar 

  14. G.T. Lim, Y.B. Park, J. Curr. Appl. Phys. 11(4), 115 (2011)

    Article  Google Scholar 

  15. L. Xu, J.H.L. Pang, Electronic components and technology conference (IEEE Inc, San Diego, 2006), p. 1154

    Google Scholar 

  16. H.Y. Chuang, W.M. Chenl, W.L. Shih, Y.S. Lai, C.R. Kao, Electronic components and technology conference (IEEE, Lake Buena Vista, 2011), p. 1723

  17. P.S. Ho, T. Kwok, J. Rep. Prog. Phys. 52(3), 301 (1989)

    Article  Google Scholar 

Download references

Acknowledgments

This work is supported by National Natural Science Foundation of China (51075107; 51174069).

Author information

Authors and Affiliations

  1. School of Material Science and Engineering, Harbin University of Science and Technology, 4# Linyuan Road, Harbin, 150040, China

    Xuemei Li, Fenglian Sun, Yang Liu, Hao Zhang & Tong Xin

Authors
  1. Xuemei Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Fenglian Sun
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Yang Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Hao Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Tong Xin
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Fenglian Sun.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Li, X., Sun, F., Liu, Y. et al. Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging. J Mater Sci: Mater Electron 25, 3742–3746 (2014). https://doi.org/10.1007/s10854-014-2084-y

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-2084-y

Keywords

Search

Navigation