Skip to main content
Log in

Fabrication of conductive copper-coated glass fibers through electroless plating process

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

A simple electroless copper plating process was employed to prepare copper-coated glass fibers with excellent conductivity. The glass fibers were pretreated by etching, sensitizing, and activating procedures. Disodium ethylenediamine tetra acetate (EDTA-2Na) and hydrazine hydrate (N2H4·H2O) were employed as complex reagent and reductant, respectively. It was found that the copper deposition was greatly influenced by dosage of EDTA-2Na, concentration of sodium hydroxide (NaOH), temperature, and volume of N2H4·H2O. The optimal temperature for electroless copper plating ranged from 40 to 60 °C. The composites were characterized by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy techniques. The result showed that the minimum volume resistivity of 0.0010 Ω cm was obtained for the sample with perfect copper coatings on the surface of glass fibers. This method is simple, low-cost, and large production, and can be extended to fabricate other metal-coated glass fibers with distinct conductivity.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  1. J.H. Byeon, J.-W. Kim, Aerosol based fabrication of a Cu/polymer and its application for electromagnetic interference shielding. Thin Solid Films 520, 1048–1052 (2011)

    Article  Google Scholar 

  2. Y.X. Lu, Q. Liang, W.L. Li, Fabrication of copper/modal fabric composites through electroless plating process for electromagnetic interference shielding. Mater. Chem. Phys. 140, 553–558 (2013)

    Article  Google Scholar 

  3. H. Wang, J.F. Jia, H.Z. Song, X. Hu, H.W. Sun, D.L. Yang, The preparation of Cu-coated Al2O3 composite powders by electroless plating. Ceram. Int. 37, 2181–2184 (2011)

    Article  Google Scholar 

  4. R.H. Zhou, H.Y. Chen, G.L. Liu, G.Z. Zhao, Y.Q. Liu, Conductive and magnetic glass microsphere/cobalt composites prepared via an electroless plating route. Mater. Lett. 112, 97–100 (2013)

    Article  Google Scholar 

  5. Y.X. Lu, S.H. Jiang, Y.M. Huang, Ultrasonic-assisted electroless deposition of Ag on PET fabric with low silver content for EMI shielding. Surf. Coat. Technol. 204, 2829–2833 (2010)

    Article  Google Scholar 

  6. R.X. Wang, X.M. Tao, Y. Wang, G.F. Wang, Electrical properties and fatigue resistance of polyamide 6, 6 fabrics with nanocrystal silver coating. J. Nanosci. Nanotechnol. 9, 3062–3066 (2009)

    Article  Google Scholar 

  7. U. Möhring, S. Gimpel, A. Neudeck, W. Scheibner, D. Zschenderlein, Conductive, sensorial and luminescent features in textile structures, 3rd international forum on applied wearable computing, TZI Universität Bremen, Germany, 2006, IFAWC

  8. A.R. Rathmell, B.J. Wiley, The synthesis and coating of long, thin copper nanowires to make flexible, transparent conducting films on plastic substrates. Adv. Mater. 23, 4798–4803 (2011)

    Article  Google Scholar 

  9. C.A. Deckert, Electroless copper plating—a review: part I. Plat. Surf. Finish. 82, 48–55 (1995)

    Google Scholar 

  10. Y.X. Lu, Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition. Appl. Surf. Sci. 256, 3554–3558 (2010)

    Article  Google Scholar 

  11. X.Y. Cui, D.A. Hutt, P.P. Conway, Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate. Thin Solid Films 520, 6095–6099 (2012)

    Article  Google Scholar 

  12. L.L. Xue, Q. Liang, Y.X. Lu, Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate. J. Mater. Sci. Mater. Electron. 24, 2211–2217 (2013)

    Article  Google Scholar 

  13. W. Su, L.B. Yao, F. Yang, P.Y. Li, J. Chen, L.F. Liang, Electroless plating of copper on surface-modified glass substrate. Appl. Surf. Sci. 257, 8067–8071 (2011)

    Article  Google Scholar 

  14. B. Girginer, B. Karagoz, M. Urgen, N. Bicak, A method for polyaniline coatings on solid polystyrene surface and electroless copper deposition. Surf. Coat. Technol. 202, 4176–4182 (2008)

    Article  Google Scholar 

  15. Y.C. Liao, Z.K. Kao, Direct writing patterns for electroless plated copper thin film on plastic substrates. ACS Appl. Mater. Interfaces 4, 5109–5113 (2012)

    Article  Google Scholar 

Download references

Acknowledgments

The research was supported by Shanxi Scholarship Council of China, and High-level Scientific Research Foundation for the Introduction of Talent through North University of China.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Huiyu Chen.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Xu, C., Liu, G., Chen, H. et al. Fabrication of conductive copper-coated glass fibers through electroless plating process. J Mater Sci: Mater Electron 25, 2611–2617 (2014). https://doi.org/10.1007/s10854-014-1919-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-014-1919-x

Keywords

Navigation