Abstract
A simple electroless copper plating process was employed to prepare copper-coated glass fibers with excellent conductivity. The glass fibers were pretreated by etching, sensitizing, and activating procedures. Disodium ethylenediamine tetra acetate (EDTA-2Na) and hydrazine hydrate (N2H4·H2O) were employed as complex reagent and reductant, respectively. It was found that the copper deposition was greatly influenced by dosage of EDTA-2Na, concentration of sodium hydroxide (NaOH), temperature, and volume of N2H4·H2O. The optimal temperature for electroless copper plating ranged from 40 to 60 °C. The composites were characterized by X-ray diffraction, scanning electron microscopy, and transmission electron microscopy techniques. The result showed that the minimum volume resistivity of 0.0010 Ω cm was obtained for the sample with perfect copper coatings on the surface of glass fibers. This method is simple, low-cost, and large production, and can be extended to fabricate other metal-coated glass fibers with distinct conductivity.
Similar content being viewed by others
References
J.H. Byeon, J.-W. Kim, Aerosol based fabrication of a Cu/polymer and its application for electromagnetic interference shielding. Thin Solid Films 520, 1048–1052 (2011)
Y.X. Lu, Q. Liang, W.L. Li, Fabrication of copper/modal fabric composites through electroless plating process for electromagnetic interference shielding. Mater. Chem. Phys. 140, 553–558 (2013)
H. Wang, J.F. Jia, H.Z. Song, X. Hu, H.W. Sun, D.L. Yang, The preparation of Cu-coated Al2O3 composite powders by electroless plating. Ceram. Int. 37, 2181–2184 (2011)
R.H. Zhou, H.Y. Chen, G.L. Liu, G.Z. Zhao, Y.Q. Liu, Conductive and magnetic glass microsphere/cobalt composites prepared via an electroless plating route. Mater. Lett. 112, 97–100 (2013)
Y.X. Lu, S.H. Jiang, Y.M. Huang, Ultrasonic-assisted electroless deposition of Ag on PET fabric with low silver content for EMI shielding. Surf. Coat. Technol. 204, 2829–2833 (2010)
R.X. Wang, X.M. Tao, Y. Wang, G.F. Wang, Electrical properties and fatigue resistance of polyamide 6, 6 fabrics with nanocrystal silver coating. J. Nanosci. Nanotechnol. 9, 3062–3066 (2009)
U. Möhring, S. Gimpel, A. Neudeck, W. Scheibner, D. Zschenderlein, Conductive, sensorial and luminescent features in textile structures, 3rd international forum on applied wearable computing, TZI Universität Bremen, Germany, 2006, IFAWC
A.R. Rathmell, B.J. Wiley, The synthesis and coating of long, thin copper nanowires to make flexible, transparent conducting films on plastic substrates. Adv. Mater. 23, 4798–4803 (2011)
C.A. Deckert, Electroless copper plating—a review: part I. Plat. Surf. Finish. 82, 48–55 (1995)
Y.X. Lu, Improvement of copper plating adhesion on silane modified PET film by ultrasonic-assisted electroless deposition. Appl. Surf. Sci. 256, 3554–3558 (2010)
X.Y. Cui, D.A. Hutt, P.P. Conway, Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate. Thin Solid Films 520, 6095–6099 (2012)
L.L. Xue, Q. Liang, Y.X. Lu, Electroless copper plating on 1,2-ethylenediamine grafted poly(ethyleneterepthalate) for the fabrication of flexible copper clad laminate. J. Mater. Sci. Mater. Electron. 24, 2211–2217 (2013)
W. Su, L.B. Yao, F. Yang, P.Y. Li, J. Chen, L.F. Liang, Electroless plating of copper on surface-modified glass substrate. Appl. Surf. Sci. 257, 8067–8071 (2011)
B. Girginer, B. Karagoz, M. Urgen, N. Bicak, A method for polyaniline coatings on solid polystyrene surface and electroless copper deposition. Surf. Coat. Technol. 202, 4176–4182 (2008)
Y.C. Liao, Z.K. Kao, Direct writing patterns for electroless plated copper thin film on plastic substrates. ACS Appl. Mater. Interfaces 4, 5109–5113 (2012)
Acknowledgments
The research was supported by Shanxi Scholarship Council of China, and High-level Scientific Research Foundation for the Introduction of Talent through North University of China.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Xu, C., Liu, G., Chen, H. et al. Fabrication of conductive copper-coated glass fibers through electroless plating process. J Mater Sci: Mater Electron 25, 2611–2617 (2014). https://doi.org/10.1007/s10854-014-1919-x
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-014-1919-x