Abstract
The microelectronic applications of lead-free solders pose ever-increasing demands. We seek to improve the solder by forming composites with Ag-coated single-walled carbon nanotubes (Ag-coated SWCNTs). These were incorporated into 96.5Sn–3.0Ag–0.5Cu solder alloy with an ultrasonic mixing technique. Composite solder pastes with 0.01–0.10 wt% nanotube reinforcement were prepared. The wettability, melting temperature, microstructure and mechanical properties of the composite solders were determined, and their dependency on nanotube loading assessed. Loading with 0.01 wt% Ag-coated SWCNTs improved the composite solder’s wetting properties, and the contact angle was reduced by 45.5 %, while over loading of the coated nanotubes up to 0.10 wt% degraded the wettability. DSC results showed only slight effects on the melting behavior of the composite solders. Cross-section microstructure analysis of the spreading specimens revealed uniform distribution of the intermetallic compounds throughout the solder matrix, and EDS analysis identified the phases as β-Sn, Ag3Sn and Cu6Sn5. The mechanical properties of composite specimens, compared with those of unloaded 96.5Sn–3.0Ag–0.5Cu solder, had a maximal improvement in the shear strength of 11 % when the nanotube loading was 0.01 wt% of Ag-coated SWCNTs.
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Acknowledgments
The authors would like to thank the Department of Mining and Materials Engineering, Faculty of Engineering, Prince of Songkla University, Hat Yai for the laboratory facilities and the Center of Excellence in Nanotechnology at Prince of Songkla University, Hat Yai for the financial support. In addition, we would like to thank the Research and Development Office (RDO), Prince of Songkla University and Associate Professor Seppo Karrila, Faculty of Science and Technology, Prince of Songkla University, Pattani Campus for commenting on the manuscript.
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Chantaramanee, S., Wisutmethangoon, S., Sikong, L. et al. Development of a lead-free composite solder from Sn–Ag–Cu and Ag-coated carbon nanotubes. J Mater Sci: Mater Electron 24, 3707–3715 (2013). https://doi.org/10.1007/s10854-013-1307-y
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DOI: https://doi.org/10.1007/s10854-013-1307-y