Abstract
The early interfacial reaction and premelting characteristics of the Sn/Cu and Sn/Ag soldering systems, and the formation and morphology transition of interfacial intermetallic compounds in the two systems during the reflow soldering process were investigated by using a differential scanning calorimeter. Results show that the initial interfacial eutectic reaction arising from atomic interdiffusion in solid-state Sn/Cu and Sn/Ag systems results in the premelting at each interface of the two systems at a temperature 4.9 and 10.6 °C respectively lower than the actual melting point of pure tin, and consequently both of the Sn/Cu and Sn/Ag soldering systems exhibit morphology change of the intermetallic compound (IMC) as the solder experiences a transition from solid-state to liquid-state in a very small temperature range. The change in the interfacial energy between the solid (or liquid) Sn-rich phase and IMC phase is the essential factor leading to the morphology transition of the interfacial IMC in the Sn/Cu and Sn/Ag soldering systems.
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Acknowledgments
This research was supported by the Science and Technology Major Project of Guangdong Province, China (2009A080204005), the fund of the State Key Laboratory of Advanced Welding and Joining in HIT (AWPT-Z04) and Research Fund for the Doctoral Program of Higher Education of China (20110172110003).
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Zhou, M.B., Ma, X. & Zhang, X.P. Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process. J Mater Sci: Mater Electron 23, 1543–1551 (2012). https://doi.org/10.1007/s10854-012-0626-8
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DOI: https://doi.org/10.1007/s10854-012-0626-8