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Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

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Abstract

In this paper, in situ tensile tests under various amounts of deformation were performed on Sn3.0Ag0.5Cu lead-free solder joints subjected to multi-reflow and isothermal aging processes by using a scanning electron microscope. Microstructure evolution and deformation behavior of the solder joints were observed. Effects of the intermetallic compound (IMC) Cu6Sn5 on fracture behaviors of the solder joints were investigated. Results showed that the Sn3.0Ag0.5Cu lead-free solder joints contained only a few Sn grains, and the sequence and degree of plastic deformation varied for the different grains in the same solder joint due to the strong anisotropic properties of Sn grains. Further experiments revealed that plastic deformation occured primarily in the form of slip bands in the solder joints during the in situ tensile test. Various fracture modes including intergranular and phase boundary fractures were observed. The fracture behaviors of solder joints were significantly affected by morphologies and distributions of the Cu6Sn5 IMCs. It was found that Cu6Sn5 particles located at the grain boundaries are apt to become crack sources, and that the long rod shaped Cu6Sn5 were easily broken. However, spherical Cu6Sn5 hardly deformed during the tensile test, resulting in dynamic recrystallization. In this case, fracture occured at the sub-grain boundaries.

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Acknowledgments

This work has been supported by the National Science Foundation of China (Grant No. 51075103). Authors are grateful to the projects (HIT. NSRIF 2009036) supported by Natural Scientific Research Innovation Foundation in Harbin Institute of Technology.

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Authors and Affiliations

  1. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China

    Yanhong Tian, Wei Liu, Rong An, Wei Zhang, Lina Niu & Chunqing Wang

  2. Mechanical Engineering Post-Doctoral Mobile Research Station, Harbin Institute of Technology, Harbin, 150001, China

    Wei Liu

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  1. Yanhong Tian
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  2. Wei Liu
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  3. Rong An
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  4. Wei Zhang
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  5. Lina Niu
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  6. Chunqing Wang
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Correspondence to Wei Liu.

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Tian, Y., Liu, W., An, R. et al. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test. J Mater Sci: Mater Electron 23, 136–147 (2012). https://doi.org/10.1007/s10854-011-0538-z

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  • DOI: https://doi.org/10.1007/s10854-011-0538-z

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