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Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

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Abstract

In this study, electrodes on a flexible printed circuit board (FPCB) and rigid PCB (RPCB) were bonded by a thermo-compression bonding. The surface finishes on the Cu electrodes of the FPCB and RPCB were organic-solderability-preservative and electroless Ni/immersion Au (ENIG), respectively. Pb-free Sn-3.0 Ag and Sn-3.0 Ag-0.5 Cu solders were used as interlayers. In order to determine the optimum bonding conditions, such as bonding force, time, and temperature, a 90° peel test of the FPCB-RPCB joint was conducted. The relationships between the bonding conditions and peel strength were investigated. We successfully accomplished the thermo-compression bonding of reliable FPCB-RPCB joints by using Sn-Ag and Sn-Ag-Cu interlayers. The thermo-compression bonding method is a stable and well-controlled process and can produce robust and reliable connections.

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Acknowledgments

The present work was carried out with the support of a Next Generation New Technology Development Program (Project No. 10030049) of the Korea Ministry of Commerce, Industry and Energy (MOCIE).

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Authors and Affiliations

  1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do, 440-746, Republic of Korea

    Jeong-Won Yoon, Jong-Gun Lee, Jong-Bum Lee, Bo-In Noh & Seung-Boo Jung

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  1. Jeong-Won Yoon
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  2. Jong-Gun Lee
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  3. Jong-Bum Lee
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  4. Bo-In Noh
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  5. Seung-Boo Jung
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Correspondence to Jeong-Won Yoon.

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Yoon, JW., Lee, JG., Lee, JB. et al. Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders. J Mater Sci: Mater Electron 23, 41–47 (2012). https://doi.org/10.1007/s10854-011-0402-1

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  • DOI: https://doi.org/10.1007/s10854-011-0402-1

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