Skip to main content
SpringerLink
Log in

Effects of rare earth Ce on properties of Sn–9Zn lead-free solder

  • Published:
Journal of Materials Science: Materials in Electronics Aims and scope Submit manuscript

Abstract

The influences of different Ce content on the properties of Sn–9Zn lead-free solder were investigated. The results indicate that Ce plays an important role not only in the structure and the solderability, but also in the interfacial structure of Sn–9Zn–xCe/Cu and mechanical property of soldered joint. Sn–9Zn–0.08Ce shows finer and more uniform microstructure than Sn–9Zn, and when the quantity of Ce is 0.5–1 wt%, some dark Sn–Ce compounds appear in the solder. With the addition of 0.08 wt% Ce, the solderability of solder is significantly improved because the surface tension of molten solder is decreased. Adding Ce makes the Cu5Zn8 IMCs formed at the interface of solder/Cu become much thicker than that of Sn–9Zn/Cu because much more content of Zn diffuse to the interface of solder/Cu to react with Cu. Results also indicate that adding 0.08 wt% Ce to the solder enhances mechanical property of soldered joint. When the Ce content is 0.1–0.5 wt%, some hard and brittle Cu–Zn IMCs appear in the bottom of dimples and the pull force of soldered joint decreases.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11

Similar content being viewed by others

References

  1. N.S. Liu, K.L. Lin, Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging. J. Alloys Compd. 456(1–2), 466–473 (2008)

    Article  CAS  Google Scholar 

  2. C.F. Yang, F.L. Chen, W. Gierlotka, Thermodynamic properties and phase equilibria of Sn-Bi-Zn ternary alloys. Mater. Chem. Phys. 112, 94–103 (2008)

    Article  CAS  Google Scholar 

  3. L. Zhang, S.B. Xue, L.L. Gao, G. Zeng, Z. Sheng, Y. Chen, S.L. Yu, Effects of rare earths on properties and microstructures of lead-free solder alloys. J. Mater. Sci. Mater. Electron. 20(8), 685–694 (2009)

    Article  CAS  Google Scholar 

  4. C.M.L. Wu, C.M.T. Law, D.Q. Yu, L. Wang, The wettability and microstructure of Sn-Zn-RE alloys. J. Electron. Mater. 32(2), 63–69 (2003)

    Article  CAS  ADS  Google Scholar 

  5. C.K. Behera, M. Shamsuddin, Thermodynamic investigations of Sn-Zn-Ga liquid solutions. Thermochim. Acta 487, 18–25 (2009)

    Article  CAS  Google Scholar 

  6. J. Zhou, Y.S. Sun, F. Xue, Effect of Nd and La on surface tension and wettability of Sn-8Zn-3Bi solders. Trans. Nonferrous Met. Soc. Chin. 15(5), 1161–1165 (2005)

    CAS  Google Scholar 

  7. X. Chen, A.M. Hu, M. Li, D.L. Mao, Study on the properties of Sn-9Zn-xCr lead-free solder. J. Alloys Compd. 460, 478–484 (2008)

    Article  CAS  ADS  Google Scholar 

  8. T.C. Hsuan, K.L. Lin, Microstructural evolution of ε-AgZn3 and η-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1 Ga solder during aging treatment. J. Alloys Compd. 409, 350–356 (2009)

    Article  Google Scholar 

  9. C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Properties of lead-free solder alloys with rare earth element additions. Mater. Sci. Eng. R Rep. 44(1), 1–44 (2004)

    Google Scholar 

  10. C.M.L. Wu, Y.W. Wong, Rare-earth additions to lead-free electronic solders. J. Mater. Sci. Mater. Electron. 18(1–3), 77–91 (2007)

    CAS  Google Scholar 

  11. C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements. J. Electron. Mater. 31, 921–927 (2002)

    Article  CAS  ADS  Google Scholar 

  12. R. Mahmudi, A.R. Geranmayeh, B. Zahiri, M.H. Marvasti, Effect of rare earth element additions on the impression creep of Sn-9Zn solder alloy. J. Mater. Sci. Mater. Electron. doi:10.1007/s10854-009-9870-y

  13. J.X. Wang, S.B. Xue, Z.J. Han, S.L. Yu, Y. Chen, Y.P. Shi, H. Wang, Effect of rare earth Ce on microstructures, solderability of Sn–Ag–Cu and Sn–Cu–Ni solders as well as mechanical properties of soldered joints. J. Alloys Compd. 467(1–2), 219–226 (2009)

    Article  CAS  Google Scholar 

  14. C.M. Chen, C.H. Chen, Interfacial reactions between eutectic SnZn solder and bulk or thin-film Cu substrates. J. Electron. Mater. 36, 1363–1371 (2007)

    Article  CAS  ADS  Google Scholar 

  15. C.H. Yu, Investigations of the Effect of Element in Sn-Zn-Ag Solder With the Reaction of Cu Metal During Soldering (National Cheng Kung University, Taiwan, 2006)

  16. Z.J. Han, S.B. Xue, J.X. Wang, X. Zhang, L. Zhang, S.L. Yu, H. Wang, Mechanical properties of QFP micro-joints soldered with lead-free solders using diode laser soldering technology. Trans. Nonferrous Met. Soc. Chin. 18, 814–818 (2008)

    Article  CAS  Google Scholar 

Download references

Acknowledgement

The authors acknowledge the financial support from Jiangsu Six Kind Skilled Personnel Project (No. 06-E-020).

Author information

Authors and Affiliations

  1. Nanjing University of Aeronautics and Astronautics, Nanjing, China

    WenXue Chen, Songbai Xue, Hui Wang & YuHua Hu

  2. Jiangsu University of Science and Technology, Zhenjiang, China

    Jianxin Wang

Authors
  1. WenXue Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Songbai Xue
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Hui Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. YuHua Hu
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Jianxin Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Songbai Xue.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Chen, W., Xue, S., Wang, H. et al. Effects of rare earth Ce on properties of Sn–9Zn lead-free solder. J Mater Sci: Mater Electron 21, 719–725 (2010). https://doi.org/10.1007/s10854-009-9984-2

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10854-009-9984-2

Keywords

Search

Navigation