Abstract
In order to further enhance the properties of lead-free solder alloys such as SnAgCu, SnAg, SnCu and SnZn, trace amount of rare earths were selected by lots of researchers as alloys addition into these alloys. The enhancement include better wettability, physical properties, creep strength and tensile strength. For Sn3.8Ag0.7Cu bearing rare earths, when the rare earths were La and Ce, the creep-rupture life of solder joints can be remarkably improved, nine times more than that of the original Sn3.8Ag0.7Cu solder joints at room temperature. In addition, creep-rupture lifetime of RE-doped solders increases by over four times for SnAg and seven times for SnCu. This paper summarizes the effects of rare earths on the wettability, mechanical properties, physical behavior and microstructure of a series of lead-free solders.
Similar content being viewed by others
References
B. Vandevelde, M. Gonzalez, P. Limaye, P. Ratchev, E. Beyne, Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages. Microelectron. Reliab. 47(2–3), 259–265 (2007). doi:10.1016/j.microrel.2006.09.034
B. Richards, K. Nimmo, An analysis of the current status of lead-free soldering. British Department of Trade in Industry Report 1999, pp. 1–9
P.K. Shiue, L.W. Tsay, C.L. Lin, J.L. Ou, The reliability study of selected Sn–Zn based lead-free solders on Au/Ni-P/Cu substrate. Microelectron. Reliab. 43(3), 453–463 (2003). doi:10.1016/S0026-2714(02)00259-7
D.Q. Yu, H.P. Xie, L. Wang, Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate. J. Alloy. Comp. 385(1–2), 119–125 (2004). doi:10.1016/j.jallcom.2004.04.129
C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Properties of lead-free solder alloys with rare earth element additions. Mater. Sci. Eng. Rep. 44(1), 1–44 (2004). doi:10.1016/j.mser.2004.01.001
Y.W. Shi, J. Tian, H. Hao, Z.D. Xai, Y.P. Lei, F. Guo, Effect of small amount addition of rare earth Er on microstructure and property of SnAgCu solder. J. Alloy. Comp. 453(1–2), 180–184 (2008). doi:10.1016/j.jallcom.2006.11.165
B. Lu, J.H. Wang, H. Li, H.W. Zhu, X.H. Jiao, Effect of cerium on microstructure and properties of Sn-0.7Cu-0.5Ni. J. Chin. Rare. Earth. 25(2), 217–222 (2007)
B. Lu, H. Li, J.H. Wang, Y.H. Zhang, Influence of trace rare earth elements on the property of Sn–Ag–Cu lead-free solder. Rare. Met. Cemented. Carbides 35(1), 27–30 (2007)
K. Sugantuma, Advances in lead-free electronics soldering. Curr. Opin. Solid State Mater. Sci. 5(1), 55–64 (2001). doi:10.1016/S1359-0286(00)00036-X
L. Zhang, S.B. Xue, Y. Chen, Z.J. Han, J.X. Wang, S.L. Yu, F.Y. Lu, Effects of cerium on Sn–Ag–Cu alloys based on finite element simulation and experiments. J. Rare. Earths 27(1), 138–144 (2009). doi:10.1016/s1002-0721(08)60208-z
D.Q. Yu, J. Zhao, L. Wang, Improvement on the microstructure stability, mechanical and wetting properties of Sn–Ag–Cu lead-free solder with the addition of rare earth elements. J. Alloy. Comp. 376(1–2), 170–175 (2004). doi:10.1016/j.jallcom.2004.01.012
L. Wang, D.Q. Yu, J. Zhao, M.L. Hhuang, Improvement of wettability and tensile property in Sn–Ag–RE lead-free solder alloy. Mater. Lett. 56(6), 1039–1042 (2002). doi:10.1016/S0167-577X(02)00672-9
S.B. Xue, L. Zhang, L.L. Gao, S.L. Yu, H. Zhu, Current Situation and Prospect on Lead-free Solders affected with micro alloying elements. Welding & Joining. 2009 (3), 24–33
C.M. Law, Reliability and interfacial reaction of lead-free solder alloys doped with rare earth elements (City University of Hong Kong, Hong Kong, 2004)
X.Q. Wei, H.Z. Huang, L. Zhou, M. Zhang, X. Liu, On the advantages of using a hypoeutectic Sn–Zn as lead-free solder materials. Mater. Lett. 61(3), 655–658 (2007). doi:10.1016/j.matlet.2006.05.029
C.M.L. Wu, C.M.T. Law, D.Q. Yu, L. Wang, The wettability and microstructure of Sn–Zn–RE alloys. J. Electron. Mater. 32(2), 63–69 (2003). doi:10.1007/s11664-003-0238-4
C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements. J. Electron. Mater. 31(9), 921–927 (2002). doi:10.1007/s11664-002-0184-6
X.Y. Zhao, M.Q. Zhao, X.Q. Cui, M.X. Tong, Effect of cerium on microstructure and mechanical properties of Sn–Ag–Cu system lead-free solder alloys. Trans. Nonferrous Met. Soc. China 17(4), 805–810 (2007). doi:10.1016/S1003-6326(07)60178-2
M.A. Dudek, R.S. Sidhu, N. Chawla, M. Renavikar, Microstructure and mechanical behavior of novel rare earth-containing Pb-free solders. J. Electron. Mater. 35(12S), 2088–2097 (2006). doi:10.1007/s11664-006-0318-3
A.G. Ramirez, H. Mavoori, S. Jin, Bonding nature of rare-earth-containing lead-free solders. Appl. Phys. Lett. 80(3), 338–340 (2002). doi:10.1063/1.1435075
W.M. Xiao, Y.W. Shi, Y.P. Lei, Z.D. Xai, F. Guo, Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys. J. Electron. Mater. 35(5), 1095–1103 (2006). doi:10.1007/BF02692572
S.B. Xue, L. Liu, Y.F. Dai, L.H. Yao, Effects of rare-earth element Ce on physical properties and mechanical properties of Sn–Ag–Cu lead-free solder. Trans. China Weld. Institution. 26(10), 23–26 (2005)
A.R. Geranmayeh, R. Mahmudi, Power law indentation creep of Sn-5%Sb solder alloy. J. Mater. Sci. 40(13), 3361–3366 (2005). doi:10.1007/s10853-005-0421-5
R. Mahmudi, A.R. Geranmayen, M. Bakherad, M. Allami, Indentation creep study of lead-free Sn-5%Sb solder alloy. Mater. Sci. Eng. A 457(1–2), 173–179 (2007). doi:10.1016/j.msea.2007.01.060
L. Zhang, S.B. Xue, Z.J. Han, J.X. Wang, L.L. Gao, Z. Sheng, Mechanical properties of fine pitch device soldered joints based on creep model. Chin. J. Mech. Eng. 21(6), 82–85 (2008). doi:10.3901/CJME.2008.06.082
L. Zhang, S.B. Xue, G. Zeng, Z.J. Han, S.L. Yu, Study on mechanical properties and numerical simulation of fine pitch devices soldered joints. Trans. China Weld. Institution. 29(10), 35–39 (2008)
C.M. Chuang, K.L. Lin, Effect of microelements addition on the interfacial reaction between Sn–Ag–Cu solders and the Cu substrate. J. Electron. Mater. 32(12S), 1426–1431 (2003). doi:10.1007/s11664-003-0111-5
M. Gonzalez, B. Vandevelde, E. Beyne, Thermo-mechanical analysis of a chip scale package (CSP) using lead-free and lead containing solder materials// European Microelectronics and Packaging Symposium, Prague, Czech Republic, June 2004, pp. 247–252
L. Zhang, S.B. Xue, Z.J. Han, S.L. Yu, Z. Sheng, The investigation of mechanical fracture morphology of lead-free soldered joints of fine pitch devices. Trans. China Weld. Institution. 29(9), 40–43 (2008)
K.K. Zhang, J. Yang, Y.L. Wang, Y.L. Fan, X. Zhang, Y.F. Yan, Research on creep properties of SnAgCuRE lead-free soldered joints//International Conference on Electronic Packaging Technology, Shanghai, China, 1–3 August, 2006
Y. Chen, S.B. Xue, X.C. Lv, Y.P. Liao, Influence of cerium on microstructure of Sn–Ag–Cu lead-free solder. Trans. China Weld. Institution. 26(10), 69–72 (2005)
X. Ma, F.J. Wang, Y.Y. Qian, F. Yoshida, Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface. Mater. Lett. 57(22–23), 3361–3365 (2003). doi:10.1016/S0167-577X(03)00075-2
Q. Liu, B. Lu, H. Li, J.H. Wang, H.W. Zhu, X.H. Jiao, Effect of adding 0.1% Ce into Sn-3.0Ag-0.5Cu solder alloy on its microstructure and intermetallic compounds with Cu substrate. J. Chin. Rare Earth Soc. 25(6), 707–712 (2007)
S.B. Xue, Y. Chen, X.C. Lv, Thermodynamic calculation and evaluation for Sn–Ag–Cu–Ce lead-free solder alloy system Sn–Ag–Cu–Ce. Trans. China. Weld. Institution. 26(5), 20–22 (2005)
X. Ma, Y.Y. Qian, F. Yoshida, Effect of La on the Cu–Sn intermetallic compound (IMC) growth and solder joint reliability. J. Alloy. Comp. 334(1), 224–227 (2002). doi:10.1016/S0925-8388(01)01747-9
M. Pei, J.M. Qu, Effect of Lanthanum doping on the microstructure of tin-silver solder alloys. J. Electron. Mater. 37(3), 331–338 (2008). doi:10.1007/s11664-007-0335-x
M. Pei, J.M. Qu, Creep and fatigue behavior of SnAg solders with Lanthanum doping. IEEE Trans. Compon. Packag. Tech. 31(3), 712–718 (2008). doi:10.1109/TCAPT.2008.922002
C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Microstructure and mechanical properties of new lead-free Sn–Cu–RE solder alloys. J. Electron. Mater. 31(9), 928–932 (2002). doi:10.1007/s11664-002-0185-5
C.M.L. Wu, A promising lead-free material for flip-chip bumps: Sn–Cu–RE//The Fourth international Conference on Advanced Semiconductor Devices and Microsystem, Smolenice Castle, Slovakia, October, 2002:17–26
H. Wang, S.B. Xue, Z.J. Han, J.X. Wang, Research status and prospect of Sn–Zn based lead-free solders. Welding & Joining. 2007 (2), 31–35
J. Villain, W. Jillek, E. Schmitt, T. Qasim, Properties and reliability of SnZn-based lead-free solder alloys//International IEEE Conference Asian Green Electronics, Hong Kong, China, January, 2004:38–41
H. Hao, J. Tian, Y.W. Shi, Y.P. Lei, Z.D. Xia, Studies on microstructure and performance of SnAgCuY lead-free solders doped with rare earth Y. Rare. Met. Mater. Eng. 35(S2), 121–123 (2006)
H. Hao, J. Tian, Y.W. Shi, Y.P. Lei, Z.D. Xia, Properties of Sn3.8Ag0.7Cu solder alloy with trace rare earth element Y additions. J. Electron. Mater. 36(7), 766–774 (2007). doi:10.1007/s11664-007-0138-0
C.M.L. Law, C.M.L. Wu, D.Q. Yu, L. Wang, J.K.L. Lai, Microstructure, solderability, and growth of intermetallic compounds of Sn–Ag–Cu–RE lead-free solder alloys. J. Electron. Mater. 35(1), 89–93 (2006). doi:10.1007/s11664-006-0189-7
Z.G. CHEN, Y.W. SHI, Z.D. XIA et al., Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints. J. Electron. Mater. 31(10), 1122–1128 (2002). doi:10.1007/s11664-002-0052-4
M.A. Dudek, R.S. Sidhu, N. Chawla, Novel rare-earth-containing lead-free solders with enhanced ductility. J. Miner. Met. Mater. Soc. 58(6), 57–62 (2006). doi:10.1007/s11837-006-0184-8
M.A. Dudek, N. Chawla, Three-dimensional (3D) microstructure visualization of LaSn3 intermetallic in a novel Sn-rich rare-earth-containing solder. Mater. Charact. 59(9), 1364–1368 (2008). doi:10.1016/j.matchar.2007.10.008
K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, C.A. Handwerker, Experimental and thermodynamic assessment of Sn–Ag–Cu solder alloys. J. Electron. Mater. 29(10), 1122–1136 (2000). doi:10.1007/s11664-000-0003-x
C.H. Raeder, G.D. Schmeelk, D. Mitlin, T. Barbieri, W. Yang, L.F. Felton, R.W. Messler, D.B. Knorr, D. Lee, Isothermal creep of eutectic SnBi and SnAg solder and solder joints//Sixteenth International Electronics Manufacturing Technology Symposium, La Jolla, CA, USA, September 1994, pp. 1–6
D.H. Kim, Reliability study of SnPb and SnAg solder joints in PBGA packages (The University of Texas, Austin, 2007)
H. Johann, C. Hoyler, M. Schneegans, H. Torwesten, Evaluation of lead-free SnAg solder ball deposition and reflow processes for flip chip applications. Mircoelectronic Eng. 82(3–4), 581–586 (2005). doi:10.1016/j.mee.2005.07.072
L. Zhang, S.B. Xue, F.Y. Lu, Z.J. Han, J.X. Wang, Numerical simulation of soldered joints and reliability analysis of PLCC components with J-shape leads. China Weld. 17(2), 37–41 (2008)
H. Mavoori, A.G. Ramirez, S. Jin, Universal solders for direct and powerful bonding on semiconductors, diamond, and optical materials. Appl. Phys. Lett. 78(19), 2976–2978 (2001). doi:10.1063/1.1370985
M. Pei, Effects of lanthanum doping on the microstructure and mechanical behavior of a SnAg alloy (Georgia Institute of Technology, Georgia, 2007)
B. Trumble, Printed circuit assembly with no lead solder assembly process//Proceeding of the IEEE International Symposium on Electronics and the Environment, San Francisco, CA, USA,1997:25–27
D.J. Luo, X.Y. Lin, R.H. Liu, Choice of lead-free solder and its countermeasure. Electron. Process. Technol. 25(5), 202–204 (2004)
V. Sunappan, P. Collier, Lead-free wave soldering development for PCB assembly//Proceeding of the 53rd Electronic Components and Technology Conference, New Orleans, May, 2003:1829–1838
Y.Q. Zheng, Effect of surface finishes and intermetallics on the reliability of SnAgCu interconnects (University of Maryland, Maryland, 2005)
B. Lu, J.H. Wang, H. Li, H.W. Zhu, X.H. Jiao, Effect of 0.10% Ce on intermetallic compounds at Sn-0.7Cu-0.5Ni/Cu. Chin. J. Nonferrous. Met. 17(3), 390–395 (2007)
J.W. Jang, I.A.P.D. Silva, T.Y. Lee, J.K. Lin, D.R. Frear, Direct correction between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology. Appl. Phys. Lett. 482(23), 49–57 (2001)
S.B. Xue, J.X. Wang, S.L. Yu, Y.P. Shi, Z.J. Han, Effects of thermal cycling on mechanical property of chip resistor joints soldered with Sn–Cu–Ni–Ce solder. Trans. China Weld. Institution 29(4), 5–8 (2008)
Y.P. Shi, S.B. Xue, J.X. Wang, L.Y. Gu, W.H. Gu, Effects of Ce on spreadability of Sn–Cu–Ni lead-free solder and mechanical properties of soldered joints. Trans. China Weld. Institution. 28(11), 73–77 (2007)
J.X. Wang, S.B. Xue, Z.J. Han, Y.P. Shi, L. Zhang, Effects of Ce on physical properties and spreadability of Sn–Cu–Ni solder. Electron. Weld. Mach. 38(9), 42–45 (2008)
Z.J. Han, S.B. Xue, J.X. Wang, S.B. Wang, Effects of Sn–Cu–Ni–Ce solder on mechanical properties of micro-joints soldered with diode-laser soldering system. Trans. China Weld. Institution. 28(1), 33–36 (2007)
J.X. Wang, S.B. Xue, X. Huang, Z.J. Han, S.L. Yu, Effects of N2 protection on wettability of Sn–Cu–Ni–Ce lead-free solder. Trans. China Weld. Institution. 28(1), 49–52 (2007)
R.A. Islam, B.Y. Wu, M.O. Alam, Y.C. Chan, W. Jillek, Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb. J. Alloy. Comp. 392(1–2), 149–158 (2005). doi:10.1016/j.jallcom.2004.08.079
M.N. Islam, Y.C. Chan, M.J. Rizvi, W. Jillek, Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder. J. Alloy. Comp. 400(1–2), 136–144 (2005). doi:10.1016/j.jallcom.2005.03.053
J.E. Lee, K.S. Kim, M. Inoue, J.X. Jiang, K. Suganuma, Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy. J. Alloy. Comp. 454(1–2), 310–320 (2008). doi:10.1016/j.jallcom.2006.12.037
H. Wang, S.B. Xue, W.X. Chen, Effects of Al addition on corrosion resistance and high-temperature oxidation resistance of Sn-9Zn lead-free solder. Electron. Weld. Mach. 38(9), 61–64 (2008)
R. Mahmudi, A.R. Geranmayeh, H. Noori, M. Shahabi, Impression creep of hypoeutectic Sn–Zn lead-free solder alloys. Mater. Sci. Eng. A. 491(1–2), 110–116 (2008). doi:10.1016/j.msea.2008.01.051
C.M.L. Wu, Y.W. Wong, Rare-earth additions to lead-free electronic solders. J. Mater. Sci.: Mater. Electron. 18(1–3), 77–91 (2007). doi:10.1007/s10854-006-9022-6
Acknowledgments
The authors greatly appreciate the financial support from the Nanjing University of Aeronautics and Astronautics Undergraduate Scientific Research Innovative(20080110), Six Kind Skilled Personnel Project of Jiangsu Province (CX07B_087z), and the Jiangsu General Colleges and Universities Postgraduate Scientific Research Innovative Plan(CX07B_087z).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Zhang, L., Xue, Sb., Gao, Ll. et al. Effects of rare earths on properties and microstructures of lead-free solder alloys. J Mater Sci: Mater Electron 20, 685–694 (2009). https://doi.org/10.1007/s10854-009-9895-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-009-9895-2