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Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders

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Abstract

In the present study, feasibility of using SnO2 as reinforcement in Sn-3.5Ag is assessed. Energy-efficient microwave assisted powder metallurgy route was used for synthesis of materials. Characterization results revealed that best combination of hardness and tensile strength was realized with 0.7 vol% of SnO2 in solder matrix. An attempt is made to correlate mechanical properties of Sn-3.5Ag with the increasing presence of SnO2 particulates at the nanometer length scale.

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Acknowledgments

The authors acknowledges the support received for this research work ref: C-534-000-003-414 from the Minerals, Metals and Materials Technology Centre (M3TC) of the National University of Singapore. Authors also wish to acknowledge Agency for Science, Technology and Research (A*STAR) for providing research scholarship.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National University of Singapore, 9 Engineering Drive 1, Singapore, 117576, Singapore

    P. Babaghorbani, S. M. L. Nai & M. Gupta

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  1. P. Babaghorbani
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  2. S. M. L. Nai
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  3. M. Gupta
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Correspondence to M. Gupta.

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Babaghorbani, P., Nai, S.M.L. & Gupta, M. Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders. J Mater Sci: Mater Electron 20, 571–576 (2009). https://doi.org/10.1007/s10854-008-9767-1

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