Abstract
This paper presents an investigation into a screen printable piezoelectric paste formulated from a blend of PZT-Pz29 powders of different mean particle size mixed in an organic vehicle. In order to enhance d33 properties of the thick-film (a piezoelectric coefficient), no binder material was mixed into the paste. The d33 coefficient and maximum applied electrical field of devices processed at peak temperatures of 150, 200, 750, 850 and 1,000°C were measured and the film adhesion assessed using scratch and tape tests. The applications that would benefit from these enhanced properties are also discussed. The thick-films produced at these processing temperatures showed good adhesion to 96% alumina substrates. They also showed the ability to withstand high electrical fields and a significant enhancement in d33 when compared to thick-film materials processed at similar temperatures using polymer or glass binders. A maximum average d33 value of 168pCN−1 was obtained for samples processed at a peak temperature of 1,000°C. This is 28% higher than the reported d33 value for a conventional piezoelectric thick-film processed at the same temperature. All samples withstood electric field strengths of over 14 MVm−1 which is between 2.5 and 4.5 times higher than that used for conventional piezoelectric thick-films.
Similar content being viewed by others
References
Available at: http://www.morganelectroceramics.com/access-pzbook.html (2005). Accessed on 26/10/2006
Available at: http://www.ferroperm-piezo.com/ (2006). Accessed on 26/10/2006
Available at: http://www.solbraze.com/ (2006). Accessed on 26/10/2006
K. Tanaka, T. Konishi, M. Ide, Z. Meng, S. Sugiyama, Jpn. J. Appl. Phys. 44, 7068 (2005)
F. Levassort, T. Bove, E. Ringgaard, J. Tran-Huu-Hue, J. Holc, M.A. Lethiecq, in 2003 IEEE Ultrasonics Symposium, Honolulu, October 2003, p. 2003
W.W. Wolny, in 12th IEEE International Symposium on Applications of Ferroelectrics, Institute of Electrical and Electronics Engineers Inc., Honolulu, July/August 2000, p. 257
M. Es-Souni, M. Kuhnke, A. Piorra, C.H. Solterbeck, J. Eur. Ceramic Soc. 25, 2499 (2005)
J.M. Hale, J.R. White, R. Stephenson, F. Liu, J. Mech. Eng. Sci. 219, 1 (2005)
P.J. Holmes, in “Hand book of thick-film technology” (Electrochemical Publications, Ayr, 1976)
Available at: http://www.ferro.com/ (2006). Accessed on 26/10/2006
T. Papakostas, N. White, Sensor Rev. 20, 135 (2000)
T.V. Papakostas, N.M. White, IEEE T. Compon. Pack. T. 24, 67 (2001)
P. Ueberschlag, Sensor Rev. 21, 118 (2001)
B. Xu, D. White, J. Zesch, A. Rodkin, S. Buhler, J. Fitch, K. Littau, Appl. Phys. Lett. 87, 192902 (2005)
B. Xu, in 106th Annual Meeting of the American Ceramic Society, American Ceramic Society, April 2004 (Westerville, Indianapolis, 2005), p. 245
R. Torah, S.P. Beeby, N.M. White, IEEE T. Ultrason. Ferr. 52, 10 (2005)
R.N. Torah, Eurosensors XVI, Prague, September 2002 (Elsevier, Prague, 2004), p. 378
R.N. Torah, Ph.D., University of Southampton, 2004
Available at: http://www.electroscience.com/ (2004). Accessed on 26/10/2006
Available at: http://www.take-control.demon.co.uk/ (2006). Accessed on 26/10/2006
P. Dargie, R. Sion, J. Atkinson, N. White, Microelectron. Int. 15, 6 (1998)
J.J. O’Dwyer in “The Theory of Electrical Conduction and Breakdown in Solid Dielectrics” (Clarendon press, Oxford, 1973) p. 271
Available at: http://www.trstechnologies.com/Materials/piezoceramics.php (2006). Accessed on 2/11/2006
M. Koch, N. Harris, R. Maas, A.G.R. Evans, N.M. White, A. Brunnschweiler, Meas. Sci. Technol. 8, 49 (1997)
D.P.J. Cotton, P.H. Chappell, A. Cranny, N.M. White, S.P. Beeby, IEEE Sensors J. (in press)
S.P. Beeby, N.J. Grabham, N.M. White, Sensor Rev. 21, 33 (2001)
P. Glynne-Jones, S.P. Beeby, P. Dargie, T. Papakostas, N.M. White, Meas. Sci. Technol. 11, 526 (2000)
Acknowledgements
The authors would like to thank Dr Elena Koukharenko for her help taking SEM micrographs.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Cotton, D.P.J., Chappell, P.H., Cranny, A. et al. A new binderless thick-film piezoelectric paste. J Mater Sci: Mater Electron 18, 1037–1044 (2007). https://doi.org/10.1007/s10854-007-9275-8
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-007-9275-8