Skip to main content
SpringerLink
Log in

Retarding microstructural evolution of multiple-elemental SnAgCu solder joints during thermal cycling by strengthening Sn matrix

  • Metals & corrosion
  • Published:
Journal of Materials Science Aims and scope Submit manuscript

Abstract

In this paper, we proposed a method of strengthening Sn-based solder to retard the microstructural evolution during thermal cycling and thus to improve the thermal fatigue life of Sn-based solder joint. We fabricated a multiple-elemental Sn-based solder by adding Ni, Bi and Sb into the Sn3.0%Ag0.5%Cu (SAC305) solder. Thermal cycling tests (− 55 °C ~ 150 °C) were performed on the prepared multiple-elemental Sn-based solder joints and SAC305 solder joints, and quasi-in situ observation was accompanied by the thermal cycling test to identify and compare the corresponding microstructural evolution process. It turned out that the intragranular dislocation movements were effectively hindered at the early stage of thermal cycling, which was due to the effects of solid solution strengthening. Furthermore, the motion of pre-existing grain boundaries and hysteresis of dislocation slip played a predominated role in the strengthened multiple-elemental solder joints. By contrast, the aforementioned two phenomena occurred concurrently in the non-strengthened solder joints. As a consequence, the multiple-elemental solder joints retained the integrity of solder joints after 1200 thermal cycles. This phenomenon indicates that the microstructural evolution was significantly delayed compared with the pristine SAC305 solder joints during thermal cycling. Therefore, SACNSB solder joints have a longer thermal fatigue life. The idea of retarding microstructure evolution during thermal cycling by strengthening Sn matrix can help open a new pathway to improve thermal fatigue life of Sn-based solder joints.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11

Similar content being viewed by others

Data availability

The data that support all plots within this paper are available from the corresponding author upon reasonable request.

References

  1. Lai Y, Chen S, Ren X et al (2022) Growth behavior and morphology evolution of interfacial (Cu, Ni)6Sn5 in (001)Cu/Sn/Ni micro solder joints. Mater Charact 186:111803. https://doi.org/10.1016/j.matchar.2022.111803

    Article  CAS  Google Scholar 

  2. Tao QB, Benabou L, Van Nguyen TA, Nguyen-Xuan H (2019) Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni. J Alloys Compd 789:183–192. https://doi.org/10.1016/j.jallcom.2019.02.316

    Article  CAS  Google Scholar 

  3. Teo JWR, Sun YF (2008) Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading. Acta Mater 56:242–249. https://doi.org/10.1016/j.actamat.2007.09.026

    Article  CAS  Google Scholar 

  4. Liu Y, Pu L, Yang Y et al (2020) A high-entropy alloy as very low melting point solder for advanced electronic packaging. Mater Today Adv 7:100101. https://doi.org/10.1016/j.mtadv.2020.100101

    Article  Google Scholar 

  5. George E, Osterman M, Pecht M, Coyle R, Parker R (2014) Thermal cycling reliability of alternative low-silver tin-based solders. J Microelectron Electron Packag 11:137–145. https://doi.org/10.4071/imaps.424

    Article  Google Scholar 

  6. Coyle RJ, Sweatman K, Arfaei B (2015) Thermal fatigue evaluation of pb-free solder joints: results, lessons learned, and future trends. JOM 67:2394–2415. https://doi.org/10.1007/s11837-015-1595-1

    Article  CAS  Google Scholar 

  7. Libot JB, Alexis J, Dalverny O et al (2018) Microstructural evolutions of Sn-3.0Ag-0.5Cu solder joints during thermal cycling. Microelectron Reliab 83:64–76. https://doi.org/10.1016/j.microrel.2018.02.009

    Article  CAS  Google Scholar 

  8. Ma ZL, Belyakov SA, Sweatman K et al (2017) Harnessing heterogeneous nucleation to control tin orientations in electronic interconnections. Nat Commun 8:1916. https://doi.org/10.1038/s41467-017-01727-6

    Article  CAS  Google Scholar 

  9. Cheng F, Nishikawa H, Takemoto T (2008) Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co. J Mater Sci 43:3643–3648. https://doi.org/10.1007/s10853-008-2580-7

    Article  CAS  Google Scholar 

  10. Du Y, Wang Y, Ji X et al (2022) Impact of Ni-coated carbon fiber on the interfacial (Cu, Ni)6Sn5 growth of Sn-3.5Ag composite solder on Cu substrate during reflow and isothermal aging. Mater Today Commun 31:103572. https://doi.org/10.1016/j.mtcomm.2022.103572

    Article  CAS  Google Scholar 

  11. Liu Y, Sun F, Liu Y, Li X (2014) Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints. J Mater Sci Mater Electron 25:2627–2633. https://doi.org/10.1007/s10854-014-1921-3

    Article  CAS  Google Scholar 

  12. Peng C, Shen J, Yin H (2013) Influences of ZrO2 nano-particles on the microstructures and microhardness of Sn8Zn1Bi–xZrO2/Cu solder joints. J Mater Sci Mater Electron 24:203–210. https://doi.org/10.1007/s10854-012-0711-z

    Article  CAS  Google Scholar 

  13. Shalaby RM, Elzanaty H (2020) Effect of nano-Al2O3 particles on the microstructure and mechanical performance of melt-spun process Sn–3.5Ag composite solder. J Mater Sci Mater Electron 31:5907–5913. https://doi.org/10.1007/s10854-019-02821-9

    Article  CAS  Google Scholar 

  14. Tao QB, Benabou L, Vivet L, Le VN, Ouezdou FB (2016) Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints. Mater Sci Eng Struct Mater Prop Misrostruct Process 669:403–416. https://doi.org/10.1016/j.msea.2016.05.102

    Article  CAS  Google Scholar 

  15. Xiuchen Z, Yanni W, Yi Li, Ying L, Yong W (2016) Effect of γ- Fe2O3 nanoparticles size on the properties of Sn-1.0Age0.5Cu nano-composite solders and joints. J Alloys Compd 662:272–282. https://doi.org/10.1016/j.jallcom.2015.11.213

    Article  CAS  Google Scholar 

  16. Wierzbicka-Miernik A, Miernik K, Filipek R, Szyszkiewicz K (2017) Kinetics of intermetallic phase growth and determination of diffusion coefficients in solid–solid-state reaction between Cu and (Sn+1at.%Ni) pads. J Mater Sci 52:10533–10544. https://doi.org/10.1007/s10853-017-1187-2

    Article  CAS  Google Scholar 

  17. Maurice N, Collins, et al (2016) Microstructural influences on thermomechanical fatigue behaviour of third generation high Ag content Pb-Free solder alloys. J Alloys Compd 688:164–170. https://doi.org/10.1016/j.jallcom.2016.07.191

    Article  CAS  Google Scholar 

  18. Hamasha SD, Akkara F, Abueed M, et al (2018) Effect of surface finish and high bi solder alloy on component reliability in thermal cycling. In: 2018 IEEE 68th electronic components and technology conference (ECTC): 2032–2040

  19. Li F, Verdingovas V, Dirscherl K et al (2020) Influence of Ni, Bi, and Sb additives on the microstructure and the corrosion behavior of Sn–Ag–Cu solder alloys. J Mater Sci: Mater Electron 31(18):15308–15321. https://doi.org/10.1007/s10854-020-04095-y

    Article  CAS  Google Scholar 

  20. El-Daly AA, El-Taher AM, Gouda S (2015) Development of new multicomponent Sn–Ag–Cu–Bi lead-free solders for low-cost commercial electronic assembly. J Alloy Compd 627:268–275

    Article  CAS  Google Scholar 

  21. El-Daly AA, Swilem Y, Hammad EA (2008) Influences of Ag and Au additions on structure and tensile strength of Sn-5Sb lead free solder alloy. J Mater Sci Technol 6:921–925. https://doi.org/10.1016/S1006-706X(08)60273-3

    Article  Google Scholar 

  22. Mahmudi R, Mahin-Shirazi S (2011) Effect of Sb addition on the tensile deformation behavior of lead-free Sn–3.5Ag solder alloy. Mater Design 32(10):5027–5032. https://doi.org/10.1016/j.matdes.2011.05.052

    Article  CAS  Google Scholar 

  23. El-Daly AA, Hammad AE, Fawzy A et al (2013) Microstructure, mechanical properties, and deformation behavior of Sn–1.0Ag–0.5Cu solder after Ni and Sb additions. Mater Design 43:40–49. https://doi.org/10.1016/j.matdes.2012.06.058

    Article  CAS  Google Scholar 

  24. Chen BL, Li GY (2004) Influence of Sb on IMC growth in Sn–Ag–Cu–Sb Pb-free solder joints in reflow process. Thin Solid Films 462:395–401. https://doi.org/10.1016/j.tsf.2004.05.063

    Article  CAS  Google Scholar 

  25. El-Daly AA, El-Taher AM, Dalloul TR (2014) Improved creep resistance and thermal behavior of Ni-doped Sn–3.0Ag–0.5Cu lead-free solder. J Alloys Compd 587:32–39. https://doi.org/10.1016/j.jallcom.2013.10.148

    Article  CAS  Google Scholar 

  26. Hammad AE (2013) Investigation of microstructure and mechanical properties of novel Sn–0.5Ag–0.7Cu solders containing small amount of Ni. Mater Design 50:108–116. https://doi.org/10.1016/j.matdes.2013.03.010

    Article  CAS  Google Scholar 

  27. Han J, Guo F, Liu JP (2017) Early stages of localized recrystallization in Pb-free BGA 18 solder joints subjected to thermomechanical stress. J Alloys and Compd 19:574–584. https://doi.org/10.1016/j.jallcom.2017.02.090

    Article  CAS  Google Scholar 

  28. Thomas RB, Zhou B et al (2012) The role of elastic and plastic anisotropy of Sn on recrystallization and damage evolution during thermal cycling in SAC305 solder joints. J Electron Mater 41(2):283–301. https://doi.org/10.1007/s11664-011-1811-x

    Article  CAS  Google Scholar 

  29. Chen H, Mueller M, Mattila TT et al (2011) Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling. J Mater Res 26:2103–2116

    Article  CAS  Google Scholar 

  30. Henderson DW, Woods JJ et al (2004) The microstructure of Sn in near-eutectic Sn–Ag–Cu alloy solder joints and its role in thermomechanical fatigue. J Mater Res 19(6):1608. https://doi.org/10.1557/JMR.2004.0222

    Article  CAS  Google Scholar 

  31. Hokka J, Mattila TT et al (2013) Thermal cycling reliability of Sn-Ag-Cu solder interconnections. Part 1: effects of test parameters. J Electron Mater 42(6):1171–1183. https://doi.org/10.1007/s11664-013-2551-x

    Article  CAS  Google Scholar 

  32. Sona M, Prabhu KN (2013) Review on microstructure evolution in Sn–Ag–Cu solders and its effect on mechanical integrity of solder joints. J Mater Sci Mater Electron 24:3149–3169. https://doi.org/10.1007/s10854-013-1240-0

    Article  CAS  Google Scholar 

  33. Matin MA, Vellinga WP, Geers MGD (2006) Microstructure evolution in a Pb-free solder alloy during mechanical fatigue. Mater Sci Eng A 431:166–174. https://doi.org/10.1016/j.msea.2006.05.144

    Article  CAS  Google Scholar 

  34. Telang AU, Bieler TR, Zamiri A, Pourboghrat F (2007) Incremental recrystallization/grain growth driven by elastic strain energy release in a thermomechanically fatigued lead-free solder joint. Acta Mater 55:2265–2277. https://doi.org/10.1016/j.actamat.2006.11.023

    Article  CAS  Google Scholar 

  35. Ji X, An R, Zhou W et al (2022) Revealing the ductile-to-brittle transition mechanism in polycrystalline body-centered tetragonal tin (Sn) for cryogenic electronics. J Alloys Compd 903:163948. https://doi.org/10.1016/j.jallcom.2022.163948

    Article  CAS  Google Scholar 

  36. Zhou B, Bieler TR, Lee T-K, Liu K-C (2009) Methodology for analyzing slip behavior in ball grid array lead-free solder joints after simple shear. J Electron Mater 38:2702. https://doi.org/10.1007/s11664-009-0929-6

    Article  CAS  Google Scholar 

  37. Zhou B, Zhou Q, Bieler TR, Lee T (2015) Slip, crystal orientation, and damage evolution during thermal cycling in high-strain wafer-level chip-scale packages. J Electron Mater 44:895–908. https://doi.org/10.1007/s11664-014-3572-9

    Article  CAS  Google Scholar 

  38. Lee T-K (2014) Fundamentals of lead-free solder interconnect technology: from microstructures to reliability. Springer, New York

    Google Scholar 

  39. Tan S, Han J, Guo F (2018) Recrystallization behavior in mixed solder joints of BGA components during thermal shock. J Electron Mater 47:4156–4164. https://doi.org/10.1007/s11664-018-6124-x

    Article  CAS  Google Scholar 

Download references

Acknowledgements

We greatly appreciate the financial support of National Natural Science Foundation of China (52001013), R&D Program of Beijing Municipal Education Commission (KZ202210005002) and Project funded by China Postdoctoral Science Foundation (2022M710271). The authors are grateful for their financial support.

Author information

Authors and Affiliations

  1. Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing, 100124, People’s Republic of China

    Xuechi Wang, Xiaoliang Ji, Yihui Du, Yishu Wang & Fu Guo

  2. Key Laboratory of Advanced Functional Materials, Education Ministry of China, Beijing University of Technology, Beijing, 100124, People’s Republic of China

    Fu Guo

  3. College of Robotics, Beijing Union University, Beijing, 100101, People’s Republic of China

    Fu Guo

Authors
  1. Xuechi Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Xiaoliang Ji
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Yihui Du
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yishu Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Fu Guo
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

XW was involved in methodology, visualization, writing—original draft. XJ contributed to formal analysis, supervision, writing—review and editing. YD was involved in methodology, visualization, writing—review and editing. YW contributed to validation, supervision, project administration. FG was involved in conceptualization, writing—review and editing, funding acquisition.

Corresponding author

Correspondence to Fu Guo.

Ethics declarations

Conflicts of interest

The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Ethical approval

This work does not involve any human tissue or bodily fluids, animal subjects, or human experiments. This manuscript has not been published in whole or in part elsewhere; this manuscript is not currently being considered for publication in another journal; all authors have been personally and actively involved in substantive work leading to the manuscript and will hold themselves jointly and individually responsible for its content.

Additional information

Handling Editor: Megumi Kawasaki.

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Wang, X., Ji, X., Du, Y. et al. Retarding microstructural evolution of multiple-elemental SnAgCu solder joints during thermal cycling by strengthening Sn matrix. J Mater Sci 58, 4199–4212 (2023). https://doi.org/10.1007/s10853-023-08280-2

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10853-023-08280-2

Search

Navigation