Abstract
Simply filling the metal foam as a thermally conductive filler into the polymer matrix can improve the thermal conductivity of the polymer matrix, but it still cannot greatly improve the thermal conductivity of the composites. In this paper, the epoxy resin/copper foam-nickel (EP/CF-Ni) composite thermal conductive material was prepared by a combination of electroplating and vacuum liquid impregnation. The deposition of nickel increases the heat dissipation area of the copper foam and at the same time widens the heat conduction path of the materials. By comparing EP/CF with different pores and EP/CF-Ni with different deposition times, it was found that the thermal conductivity of EP/CF-Ni composites could reach 5.215 W/(mK) at 7.3 wt% nickel deposition, which enhanced 2507% and 75% compared to pure epoxy and copper foam matrix composites, respectively. The deposition of nickel further improves the wear resistance of the composite. This experiment reveals the synergistic effect of thermal conductivity of metallic Ni and 3D copper foam, and provides some reference opinions for the field of thermal conductivity of metallic foam.
Similar content being viewed by others
References
Xue Y, Lofland S, Hu X (2020) Protein-based flexible thermal conductive materials with continuous network structure: Fabrication, properties, and theoretical modeling. Compos B Eng 201:108377. https://doi.org/10.1016/j.compositesb.2020.108377
Burger N, Laachachi A, Ferriol M, Lutz M, Toniazzo V, Ruch D (2016) Review of thermal conductivity in composites: Mechanisms, parameters and theory. Prog Polym Sci 61:1–28. https://doi.org/10.1016/j.progpolymsci.2016.05.001
Ruan K, Guo Y, Gu J (2021) Liquid crystalline polyimide films with high intrinsic thermal conductivities and robust toughness. Macromolecules 54:4934–4944. https://doi.org/10.1021/acs.macromol.1c00686
Ruan K, Zhong X, Shi X, Dang J, Gu J (2021) Liquid crystal epoxy resins with high intrinsic thermal conductivities and their composites: a mini-review. Mater Today Phys 20:100456. https://doi.org/10.1016/j.mtphys.2021.100456
Koh YR, Cheng Z, Mamun A, Bin Hoque MS, Liu Z, Bai T, Hussain K, Liao ME, Li R, Gaskins JT, Giri A, Tomko J, Braun JL, Gaevski M, Lee E, Yates L, Goorsky MS, Luo T, Khan A, Graham S, Hopkins PE (2020) Bulk-like intrinsic phonon thermal conductivity of micrometer-thick AlN films. ACS Appl Mater Interfaces 12:29443–29450. https://doi.org/10.1021/acsami.0c03978
Chen W, Wu K, Qu Z, Lu M (2019) Intrinsic high thermal conductive co-polyester based on offset π-π stacking. Eur Polym J 121:109275. https://doi.org/10.1016/j.eurpolymj.2019.109275
Wang X, Liu H, Qiu X, Wang L, Wang L (2018) Thermal conductivity of filled composite materials considering interactions between fillers. Appl Therm Eng 141:835–843. https://doi.org/10.1016/j.applthermaleng.2018.06.022
Liu S, Zhao B, Jiang L, Zhu Y-W, Fu X-Z, Sun R, Xu J-B, Wong C-P (2018) Core–shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction. J Mater Chem C 6:257–265. https://doi.org/10.1039/C7TC04427E
He X, Wang Y (2019) Synergistic effects on the enhancement of thermal conductive properties of thermal greases. J Appl Polym Sci 136:47726. https://doi.org/10.1002/app.47726
Gu J, Ruan K (2021) Breaking through bottlenecks for thermally conductive polymer composites: a perspective for intrinsic thermal conductivity, interfacial thermal resistance and theoretics. Nanomicro Lett 13:110. https://doi.org/10.1007/s40820-021-00640-4
Luo F, Yan P, Li H, Qian Q, Huang B, Chen Q, Wu K, Lu M (2020) Ultrahigh thermally conductive graphene filled liquid crystalline epoxy composites: preparation assisted by polyethylene glycol. Compos Sci Technol 200:108473. https://doi.org/10.1016/j.compscitech.2020.108473
Ryu SH, Cho H-B, Kwon Y-T, Song Y, Lee J, Lee S-B, Choa Y-H (2020) Quasi-isotropic thermal conduction in percolation networks: using the pore-filling effect to enhance thermal conductivity in polymer nanocomposites. ACS Appl Polym Mater 3:1293–1305. https://doi.org/10.1021/acsapm.0c01061
Wu X, Shi S, Tang B, Chen J, Shan L, Gao Y, Wang Y, Jiang T, Sun K, Yang K, Yu J (2022) Achieving highly thermal conductivity of polymer composites by adding hybrid silver–carbon fiber fillers. Compos Commun 31:101129. https://doi.org/10.1016/j.coco.2022.101129
Dai S, Li J, Lu N (2020) Research progress of diamond/copper composites with high thermal conductivity. Diamond Relat Mater 108:107993. https://doi.org/10.1016/j.diamond.2020.107993
Zhan K, Zhao R, Li F, Wang T, Mo W, Yang Z, Zhao B (2021) Fabrication of graphite/Cu composite foils with ultrahigh thermal conductivity by adding an intermediate nickel layer and vacuum hot pressing treatment. J Alloy Compd 886:161228. https://doi.org/10.1016/j.jallcom.2021.161228
Wen Y, Chen C, Feng Y, Xue Z, Zhou X, Xie X, Mai Y-W (2020) Effects of selective distribution of alumina micro-particles on rheological, mechanical and thermal conductive properties of asphalt/SBS/alumina composites. Compos Sci Technol 186:107917. https://doi.org/10.1016/j.compscitech.2019.107917
Ren L, Zeng X, Sun R, Xu J-B, Wong C-P (2019) Spray-assisted assembled spherical boron nitride as fillers for polymers with enhanced thermally conductivity. Chem Eng J 370:166–175. https://doi.org/10.1016/j.cej.2019.03.217
Lule ZC, Kim J (2020) Thermally conductive polybutylene succinate composite filled with Si–O–N–C functionalized silicon carbide fabricated via low-speed melt extrusion. Eur Polym J 134:109849. https://doi.org/10.1016/j.eurpolymj.2020.109849
Ruan Y, Li N, Liu C, Chen L, Zhang S, Wang Z (2020) Increasing heat transfer performance of thermoplastic polyurethane by constructing thermal conduction channels of ultra-thin boron nitride nanosheets and carbon nanotubes, New. J Chem 44:18823–18830. https://doi.org/10.1039/D0NJ04215C
Guo M, Qian Y, Qi H, Bi K, Chen Y (2020) Experimental measurements on the thermal conductivity of strained monolayer graphene. Carbon 157:185–190. https://doi.org/10.1016/j.carbon.2019.10.027
Liu Y, Li Y, Xing J, Wang S, Zheng B, Tao D, Li W (2018) Effect of graphite morphology on the tensile strength and thermal conductivity of cast iron. Mater Charact 144:155–165. https://doi.org/10.1016/j.matchar.2018.07.001
Wu X, Tang B, Chen J, Shan L, Gao Y, Yang K, Wang Y, Sun K, Fan R, Yu J (2021) Epoxy composites with high cross-plane thermal conductivity by constructing all-carbon multidimensional carbon fiber/graphite networks. Compos Sci Technol 203:108610. https://doi.org/10.1016/j.compscitech.2020.108610
Ruan K, Shi X, Guo Y, Gu J (2020) Interfacial thermal resistance in thermally conductive polymer composites: a review. Compos Commun 22:100518. https://doi.org/10.1016/j.coco.2020.100518
Li L, Zhou B, Han G, Feng Y, He C, Su F, Ma J, Liu C (2020) Understanding the effect of interfacial engineering on interfacial thermal resistance in nacre-like cellulose nanofiber/graphene film. Compos Sci Technol 197:108229. https://doi.org/10.1016/j.compscitech.2020.108229
Li M, Li L, Hou X, Qin Y, Song G, Wei X, Kong X, Zhang Z, Do H, Greer JC, Han F, Cai T, Dai W, Lin C-T, Jiang N, Yu J (2021) Synergistic effect of carbon fiber and graphite on reducing thermal resistance of thermal interface materials. Compos Sci Technol 212:108883. https://doi.org/10.1016/j.compscitech.2021.108883
Tan F, Han S, Peng D, Wang H, Yang J, Zhao P, Ye X, Dong X, Zheng Y, Zheng N, Gong L, Liang C, Frese N, Gölzhäuser A, Qi H, Chen S, Liu W, Zheng Z (2021) Nanoporous and highly thermal conductive thin film of single-crystal covalent organic frameworks ribbons. J Am Chem Soc 143:3927–3933. https://doi.org/10.1021/jacs.0c13458
Cheng R, Li W, Wei W, Huang J, Li S (2021) Molecular insights into the correlation between microstructure and thermal conductivity of zeolitic imidazolate frameworks. ACS Appl Mater Interfaces 13:14141–14149. https://doi.org/10.1021/acsami.0c21220
Cong R, Xu C, Chen Y, Ran F, Fang G (2021) Enhanced thermal conductivity of palmitic acid/copper foam composites with carbon nanotube as thermal energy storage materials. J Energy Storage 40:102783. https://doi.org/10.1016/j.est.2021.102783
Zhu W, Hu N, Wei Q, Zhang L, Li H, Luo J, Lin C-T, Ma L, Zhou K, Yu Z (2019) Carbon nanotube-Cu foam hybrid reinforcements in composite phase change materials with enhanced thermal conductivity. Mater Des 172:107709. https://doi.org/10.1016/j.matdes.2019.107709
Sheng N, Zhu C, Rao Z (2021) Solution combustion synthesized copper foams for enhancing the thermal transfer properties of phase change material. J Alloy Compd 871:159458. https://doi.org/10.1016/j.jallcom.2021.159458
Lee S, Kim J (2020) Thermally conductive 3D binetwork structured aggregated boron nitride/Cu-foam/polymer composites. Synth Met 270:116587. https://doi.org/10.1016/j.synthmet.2020.116587
Zheng X, Gao X, Huang Z, Li Z, Fang Y, Zhang Z (2021) Form-stable paraffin/graphene aerogel/copper foam composite phase change material for solar energy conversion and storage. Sol Energy Mater Sol Cells 226:111083. https://doi.org/10.1016/j.solmat.2021.111083
Wang C, Lin T, Li N, Zheng H (2016) Heat transfer enhancement of phase change composite material: copper foam/paraffin. Renew Energy 96:960–965. https://doi.org/10.1016/j.renene.2016.04.039
Xiao Q, Zhang M, Fan J, Li L, Xu T, Yuan W (2019) Thermal conductivity enhancement of hydrated salt phase change materials employing copper foam as the supporting material. Sol Energy Mater Sol Cells 199:91–98. https://doi.org/10.1016/j.solmat.2019.04.020
Acknowledgements
This work was financially supported by the Project Funded by China Postdoctoral Science Foundation (2017M611757), the Special Fund of the National Natural Science Foundation of China (51573201and 51803119) and Shanghai High-level Local University Innovation Team (Maritime safety & technical support).
Author information
Authors and Affiliations
Corresponding authors
Ethics declarations
Conflict of interest
The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.
Additional information
Handling Editor: Catalin Croitoru.
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
Springer Nature or its licensor holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Jiang, T., Wang, Y., Zhang, S. et al. Epoxy/ copper-nickel metal foam composites with high thermal conductivity using an electroplating method. J Mater Sci 57, 15374–15384 (2022). https://doi.org/10.1007/s10853-022-07588-9
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10853-022-07588-9