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Review: additive manufacturing of pure tungsten and tungsten-based alloys

  • Metal Additive Manufacturing
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Abstract

Tungsten is a refractory metal that has a wide range of applications in many fields. However, its high ductile-to-brittle transition temperature limits its processing and machining. While additive manufacturing is an emerging tool for manufacturing complex tungsten parts, cracking and low densification are the main challenges with printing W samples. Studies have been done using different additive manufacturing processes to fabricate high dense free of crack samples, without much success. To address this important challenge, extensive efforts have been made to investigate the effect of different processing conditions—such as laser/electron beam power, scanning speed, hatch spacing, and substrate preheating temperature—on the quality of the print. In this contribution, the most recent and relevant literature on the additive manufacturing of W and W-based alloys is reviewed. The literature is critically assessed in order to systematically investigate and report on the effect of different processing parameters on the morphology, densification, and mechanical properties of the additively manufactured W and W-based alloy parts.

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Acknowledgements

This research was supported by NASA-ESI Program under Grant Number 80NSSC21K0223.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, Texas A&M University, 3003 TAMU, College Station, TX, 77840, USA

    Peter Morcos, Ibrahim Karaman & Raymundo Arróyave

  2. Wm Michael Barnes’64 Department of Industrial Systems Engineering, Texas A&M University, College Station, TX, 77843, USA

    Alaa Elwany

  3. Department of Mechanical Engineering, Texas A&M University, College Station, TX, 77840, USA

    Raymundo Arróyave

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  1. Peter Morcos
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Correspondence to Peter Morcos.

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Morcos, P., Elwany, A., Karaman, I. et al. Review: additive manufacturing of pure tungsten and tungsten-based alloys. J Mater Sci 57, 9769–9806 (2022). https://doi.org/10.1007/s10853-022-07183-y

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  • DOI: https://doi.org/10.1007/s10853-022-07183-y