Abstract
We investigated the effects of palladium and silver seed chemistries on the electroless deposition of copper nanoparticles on electrospun polyacrylonitrile (PAN) fibers to identify conditions that enable formation of either conformal coatings or isolated metallic nanoparticles. The kinetics of Cu deposition was enhanced on Pd seeded fibers over Ag seeding, and continuous growth of copper nanoparticles conformal to the PAN fibers was achieved in instances with high seed density for both seed chemistries. A discrete distribution of copper nanoparticles was observed for low density silver seeding. Furthermore, the high density Ag seeds promoted dense and compact copper nanoparticle films, while the films on the Pd seeded fibers were rough with inclusions of microporosity. Raman spectroscopy revealed that a higher ratio of the D to G bands formed during processing, indicative of more cyclization of nitrile groups in surface PAN molecules during the seeding and deposition processes, corresponds to a higher seeding density. Thermal stability of PAN is enhanced with isolated Pd seeds present where the seed size is lower than the mean free path for electron conduction, but degrades as larger seeds or more dense and compact metallic shells are formed on the fibers.
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Acknowledgements
This work was funded by the National Science Foundation under grant CMMI 1634772. The Authors will also like to thank Robert Seiler and Shuvo Shoumya of the Life Science Microscopy facility at Purdue University for assistance with T.E.M sample preparation and imaging.
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Aminu, T.Q., Bahr, D.F. Control of copper nanoparticle metallization on electrospun fibers via Pd and Ag seed-assisted templating. J Mater Sci 56, 16307–16323 (2021). https://doi.org/10.1007/s10853-021-06326-x
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DOI: https://doi.org/10.1007/s10853-021-06326-x