Journal of Materials Science

, Volume 53, Issue 18, pp 12988–12995 | Cite as

Size-controllable copper nanomaterials for flexible printed electronics

  • Yu Zhang
  • Chengqiang Cui
  • Bin Yang
  • Kai Zhang
  • Pengli Zhu
  • Gang Li
  • Rong Sun
  • Chingping Wong
Electronic materials


Size-controllable copper nanomaterials were easily obtained via an improved polyol process by regulating the dosage of copper source and reducing agent. The monodisperse copper nanoparticles with strong antioxidation properties were employed as fillers to fabricate conductive ink. The copper-based ink could be screen-printed onto flexible substrates, which shows persistent stability and uniform properties without color change for a few days. After heating at 240 °C (40 min) in N2 atmosphere, a low electrical resistivity of 16.2 μΩ cm was obtained for the copper nanomaterial-based conductive pattern.



This work is partially supported by the National Natural Science Foundation of China (61704033, U1601202), the Foundation for Distinguished Young Talents in Higher Education of Guangdong (2016KQNCX046), and the Fund of Guangdong R&D Science and Technology (2017A050501053, 2017A010106005, 2017A050506053).

Compliance with ethical standards

Conflict of interest

The authors declare no competing financial interest.


  1. 1.
    Tam SK, Fung KY, Ng KM (2016) Copper pastes using bimodal particles for flexible printed electronics. J Mater Sci 51:1914–1922. CrossRefGoogle Scholar
  2. 2.
    Li JJ, Cheng CL, Shi TL, Fan JH, Yu X, Cheng SY, Liao GL, Tang ZR (2016) Surface effect induced Cu–Cu bonding by Cu nanosolder paste. Mater Lett 184:193–196CrossRefGoogle Scholar
  3. 3.
    Kim D, Jeong S, Moon J (2006) Synthesis of silver nanoparticles using the polyol process and the influence of precursor injection. Nanotechnology 17:4019–4024CrossRefGoogle Scholar
  4. 4.
    Perelaer J, Smith PJ, Mager D, Soltman D, Volkman SK, Subramanian V, Korvink JG, Schubert US (2010) Printed electronics: the challenges involved in printing devices, interconnects, and contacts based on inorganic materials. J Mater Chem 20:8446–8453CrossRefGoogle Scholar
  5. 5.
    Guo R, Yu Y, Xie Z, Liu X, Zhou X, Gao Y, Liu Z, Zhou F, Yang Y, Zheng Z (2013) Matrix-assisted catalytic printing for the fabrication of multiscale, flexible, foldable, and stretchable metal conductors. Adv Mater 25:3343–3350CrossRefGoogle Scholar
  6. 6.
    Jiu J, Zhang H, Nagao S, Sugahara T, Kagami N, Suzuki Y, Akai Y, Suganuma K (2016) Die-attaching silver paste based on a novel solvent for high-power semiconductor devices. J Mater Sci 51:3422–3430. CrossRefGoogle Scholar
  7. 7.
    Komoda N, Nogi M, Suganuma K, Otsuka K (2012) Highly sensitive antenna using inkjet overprinting with particle-free conductive inks. ACS Appl Mater Interfaces 4:5732–5736CrossRefGoogle Scholar
  8. 8.
    Dong Q, Huang C, Duan G, Zhang F, Yang D (2017) Facile synthesis and electrical performance of silica-coated copper powder for copper electronic pastes on low temperature co-fired ceramic. Mater Lett 186:263–266CrossRefGoogle Scholar
  9. 9.
    Deng D, Jin Y, Cheng Y, Qi T, Xiao F (2013) Copper nanoparticles: aqueous phase synthesis and conductive films fabrication at low sintering temperature. ACS Appl Mater Interfaces 5:3839–3846CrossRefGoogle Scholar
  10. 10.
    Perelaer J, Gans BJ, Schubert US (2006) Ink-jet printing and microwave sintering of conductive silver tracks. Adv Mater 18:2101–2104CrossRefGoogle Scholar
  11. 11.
    Yan GQ, Wang L, Zhang L (2010) Recent research progress on preparation of silver nanowires by soft solution method, preparation of gold nanotubes and Pt nanotubes from resultant silver nanowires and their applications in conductive adhesive. Rev Adv Mater Sci 24:10–25Google Scholar
  12. 12.
    Ghosh S, Yang R, Kaumeyer M, Zorman C, Rowan S, Feng P, Sankaran R (2014) Fabrication of electrically conductive metal patterns at the surface of polymer films by microplasma-based direct writing. ACS Appl Mater Interfaces 6:3099–3104CrossRefGoogle Scholar
  13. 13.
    Jang S, Seo Y, Choi J, Kim T, Cho J, Kim S, Kim D (2010) Sintering of inkjet printed copper nanoparticles for flexible electronics. Scripta Mater 62:258–261CrossRefGoogle Scholar
  14. 14.
    Eivazihollagh A, Bäckström J, Dahlström C, Carlsson F (2017) One-pot synthesis of cellulose-templated copper nanoparticles with antibacterial properties. Mater Lett 187:170–172CrossRefGoogle Scholar
  15. 15.
    Zhang HX, Siegert U, Liu R, Cai WB (2009) Facile fabrication of ultrafine copper nanoparticles in organic solvent. Nanoscale Res Lett 4:705–708CrossRefGoogle Scholar
  16. 16.
    Sarkar A, Mukherjee T, Kapoor S (2008) PVP-stabilized copper nanoparticles: a reusable catalyst for “click” reaction between terminal alkynes and azides in nonaqueous solvents. J Phys Chem C 112:3334–3340CrossRefGoogle Scholar
  17. 17.
    Park BK, Jeong S, Kim D, Moon J, Lim S, Kim JS (2007) Synthesis and size control of monodisperse copper nanoparticles by polyol method. J Colloid Interface Sci 311:417–424CrossRefGoogle Scholar
  18. 18.
    Xu M, Peng W, Cai J, Li X, Liu Z, Huai X (2015) Ultrasound-assisted synthesis and characterization of ultrathin copper nanowhiskers. Mater Lett 161:164–167CrossRefGoogle Scholar
  19. 19.
    Yan J, Zou G, Hu A, Zhou YN (2011) Preparation of PVP coated Cu NPs and the application for low-temperature bonding. J Mater Chem 21:15981–15986CrossRefGoogle Scholar
  20. 20.
    Magdassi S, Grouchko M, Kamyshny A (2010) Copper nanoparticles for printed electronics: routes towards achieving oxidation stability. Materials 3:4626–4638CrossRefGoogle Scholar
  21. 21.
    Sun JH, Jing Y, Jia YZ, Tillard M, Belin C (2005) Mechanism of preparing ultrafine copper powder by polyol process. Mater Lett 59:3933–3936CrossRefGoogle Scholar
  22. 22.
    Mott D, Galkowski J, Wang LY, Luo J, Zhong CJ (2007) Synthesis of size-controlled and shaped copper nanoparticles. Langmuir 23:5740–5745CrossRefGoogle Scholar
  23. 23.
    Engels V, Benaskar F, Jefferson DA, Johnson BF, Wheatley AE (2010) Nanoparticulate copper-routes towards oxidative stability. Dalton Trans 28:6496–6502Google Scholar

Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  • Yu Zhang
    • 1
  • Chengqiang Cui
    • 1
  • Bin Yang
    • 1
  • Kai Zhang
    • 1
  • Pengli Zhu
    • 2
  • Gang Li
    • 2
  • Rong Sun
    • 2
  • Chingping Wong
    • 3
    • 4
  1. 1.School of Electromechanical Engineering and Key Laboratory of Mechanical Equipment Manufacturing and Control Technology of Ministry of EducationGuangdong University of TechnologyGuangzhouChina
  2. 2.Shenzhen Institutes of Advanced TechnologyChinese Academy of SciencesShenzhenChina
  3. 3.Department of Electronics EngineeringThe Chinese University of Hong KongShatin NTChina
  4. 4.School of Materials Science and EngineeringGeorgia Institute of TechnologyAtlantaUSA

Personalised recommendations