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Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles

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Abstract

In this work, SAC305 lead-free solder reinforced with 0.1 wt. % fullerene nanoparticles was prepared using a powder metallurgy method. A lab-made setup and a corresponding Cu/solder/Cu sample for thermo-migration (TM) test were designed and implemented. The feasibility of this setup for TM stressing was further verified with experimental and simulation methods; a temperature gradient in a solder seam was calculated as 1070 K/cm. Microstructural evolution and mechanical properties of both plain and composite solder alloys were then studied under the condition of TM stressing. It was shown that compared to unreinforced SAC305 solder, the process of diffusion of Cu atoms in the composite solder seam was remarkably suppressed. After the TM test for 600 h, Cu/solder interfaces in the composite solder seam were more stable and the inner structure remained more intact. Moreover, the addition of fullerene reinforcement can considerably affect a distribution of Cu6Sn5 formed as a result of dissolution of Cu atoms during the TM test. Hardness data across the solder seam were also found notably different because of the elemental redistribution caused by TM.

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Acknowledgements

The authors acknowledge research funding by the National Nature Science Foundation of China (NSFC) and The Research Grants Council (RGC) Joint Research project (NSFC No. 61261160498, RGC No.CityU101/12). This research was also supported by the China-European Union Technology Cooperation Project (No. 1110) as well as the Marie Curie International Research Staff Exchange Scheme Project within the 7th European Community Framework Programme, (No. PIRSES-GA-2010-269113). Thanks are also to the Analytical and Testing Centre at Huazhong University of Science Technology as well as LMCC at Loughborough University for their analytical and testing services.

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Authors and Affiliations

  1. State Key Laboratory of Materials Processing and Die and Mould Technology, Huazhong University of Science and Technology, Wuhan, 430074, China

    Guang Chen & Fengshun Wu

  2. Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Loughborough, UK

    Guang Chen, Li Liu, Juan Du, Vadim V. Silberschmidt & Changqing Liu

  3. Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong

    Y. C. Chan

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  1. Guang Chen
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  2. Li Liu
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Correspondence to Changqing Liu or Fengshun Wu.

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Chen, G., Liu, L., Du, J. et al. Thermo-migration behavior of SAC305 lead-free solder reinforced with fullerene nanoparticles. J Mater Sci 51, 10077–10091 (2016). https://doi.org/10.1007/s10853-016-0234-8

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  • DOI: https://doi.org/10.1007/s10853-016-0234-8

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