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Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

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Abstract

The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 solder/Cu substrate interface by flux mixing. The effects of Ni NP addition on electromigration (EM) under high current density were investigated. EM tests with a maximum duration of 1128 h were conducted under a current density of 1 × 104 A/cm2, at 80 ± 3 °C on the solders prepared using 0 and 2 wt% Ni NPs-doped flux. At 2 wt% Ni NPs addition to flux, the growth rate of interfacial IMC at the anode side decreased by more than five times. No significant change in electrical resistance was observed in 2 wt% samples for up to 1128 h. Ni NP addition at the solder/substrate through flux mixing is, therefore, expected to lead to more reliable solder joints.

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Acknowledgements

The authors acknowledge the financial support of High Impact Research grant (UM.C/HIR/MOHE/ENG/26, Grant No. D000026-16001).

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of Malaya, 50603, Kuala Lumpur, Malaysia

    M. Nasir Bashir, A. S. M. A. Haseeb, Abu Zayed Mohammad Saliqur Rahman & M. A. Fazal

  2. Department of Materials Science and Engineering, National Taiwan University, Taipei, 106, Taiwan

    C. R. Kao

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  1. M. Nasir Bashir
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  2. A. S. M. A. Haseeb
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  3. Abu Zayed Mohammad Saliqur Rahman
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  4. M. A. Fazal
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Correspondence to A. S. M. A. Haseeb or Abu Zayed Mohammad Saliqur Rahman.

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Bashir, M.N., Haseeb, A.S.M.A., Rahman, A.Z.M.S. et al. Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping. J Mater Sci 50, 6748–6756 (2015). https://doi.org/10.1007/s10853-015-9230-7

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  • DOI: https://doi.org/10.1007/s10853-015-9230-7

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