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Characterization of the isothermal solidification process in the Ni/Au–Ge layer system

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Abstract

The eutectic Au28Ge (at.%) solder alloy in combination with Ni substrates or Ni coatings is interesting for applications in transient liquid phase (TLP) bonding. To achieve sound joints with high re-melting temperatures, it is necessary to gain profound knowledge about the joining process. In this work, the isothermal solidification behavior in the Ni–Au28Ge (at.%) system was analyzed by means of microstructure evolution and time to complete solidification. In short-time annealing experiments the early stage of the reaction (<300 s over liquidus temperature) was investigated. It was observed that a continuous layer of Ni5Ge3 forms at the substrate–solder interface before scallop-like NiGe grains start to grow as solidification proceeds. Cyclic differential scanning calorimetry measurements were applied to estimate the time to complete solidification. Solidification was completed after less than 1 h in the Ni–Au28Ge (at.%) system, which enables comparably short processing times for TLP bonding.

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Authors and Affiliations

  1. Laboratory for Joining Technologies and Corrosion, Empa – Swiss Federal Laboratories for Materials Science and Technology, Überlandstrasse 129, 8600, Dübendorf, Switzerland

    Nico Weyrich & Christian Leinenbach

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  1. Nico Weyrich
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  2. Christian Leinenbach
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Correspondence to Nico Weyrich.

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Weyrich, N., Leinenbach, C. Characterization of the isothermal solidification process in the Ni/Au–Ge layer system. J Mater Sci 50, 3835–3844 (2015). https://doi.org/10.1007/s10853-015-8952-x

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  • DOI: https://doi.org/10.1007/s10853-015-8952-x

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