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Formation of intermetallic compounds in Mg–Ag–Al joints during diffusion bonding

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Abstract

In this study, we conducted the diffusion bonding of Mg and Al alloys using a 30-μm-thick pure silver foil interlayer at median temperatures between 390 and 490 °C. We obtained a multilayered structure across the Mg–Ag–Al joint: Mg/Mg(ss, Ag)/Mg3Ag/MgAg/Ag/Ag(ss, Al)/Ag2Al/Al. The silver diffusion barrier prevented the formation of brittle intermetallics between Mg and Al. Intermetallics identified at the joint interface include the more ductile types between Mg and Ag, ε-Mg3Ag and β′-MgAg, and Ag and Al, δ-Ag2Al. As the bonding temperature increased, Ag2Al, followed by MgAg, favored the growth of Mg3Ag IMC layer. The shear strength of the joints increased with the rising bonding temperature to a maximum value of 11.8 MPa at 470 °C. Fracture failure in the joints mainly occurred in the Ag2Al layer. The formation mechanism for interfacial layers in the joints is believed to consist of four stages: (1) solid-solution formation, (2) Mg–Ag IMC formation, (3) Ag–Al IMC formation, and (4) growth of Mg–Ag and Ag–Al IMCs.

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Acknowledgements

The authors gratefully acknowledge financial support from the National Natural Science Foundation of China (No: 51202175), the 111 Project (B13035) of China, the Fundamental Research Funds for the Central Universities (WUT: 2013-II-024), State Key Laboratory of Advanced Technology for Materials Synthesis and Processing (Wuhan University of Technology, Grant No: 2014-KF-7) and China Scholarship Council.

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Authors and Affiliations

  1. State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan, 430070, People’s Republic of China

    Yiyu Wang, Guoqiang Luo, Qiang Shen & Lianmeng Zhang

  2. Department of Chemical and Materials Engineering, University of Alberta, Edmonton, AB, TG6 2V4, Canada

    Yiyu Wang & Leijun Li

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  1. Yiyu Wang
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  2. Guoqiang Luo
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  3. Leijun Li
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  4. Qiang Shen
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  5. Lianmeng Zhang
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Correspondence to Guoqiang Luo.

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Wang, Y., Luo, G., Li, L. et al. Formation of intermetallic compounds in Mg–Ag–Al joints during diffusion bonding. J Mater Sci 49, 7298–7308 (2014). https://doi.org/10.1007/s10853-014-8440-8

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  • DOI: https://doi.org/10.1007/s10853-014-8440-8

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