Journal of Materials Science

, Volume 49, Issue 4, pp 1716–1723 | Cite as

Bonding and interfacial reaction between Ni foil and n-type PbTe thermoelectric materials for thermoelectric module applications

  • Haiyang Xia
  • Fivos Drymiotis
  • Cheng-Lung Chen
  • Aiping Wu
  • G. Jeffrey Snyder
Article

Abstract

Integration of next generation thermoelectric materials in thermoelectric modules requires a novel or alternative approach for mating the brittle semiconducting thermoelectric materials and the ductile metal interconnects. In this study, pure Ni foil was directly bonded to PbTe-based thermoelectric materials using a rapid hot-press. The materials were sintered at 600 and 650 °C, under a pressure of 40 MPa and for various holding times. The resulting interfacial microstructures of the Ni/PbTe joints were investigated. Additionally, the distributions of elements and the phases formed at the Ni/PbTe interface were analyzed. The β2 phase (NixTe2, 38.8–41 at.% Te) was identified at the Ni/PbTe joints bonded at both 600 and 650 °C. A ternary phase with approximate composition Ni5Pb2Te3 was found at the Ni/PbTe joints bonded at 650 °C. Additionally, the PbTe(Ni) phase was observed along the Ni grain boundaries for both bonding temperatures. Thermodynamics calculation results indicate that only the β2 phase can be formed at the Ni/PbTe interface at 900 K among the binary nickel tellurides.

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Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  • Haiyang Xia
    • 1
    • 2
    • 3
  • Fivos Drymiotis
    • 1
  • Cheng-Lung Chen
    • 1
    • 4
  • Aiping Wu
    • 2
    • 3
  • G. Jeffrey Snyder
    • 1
  1. 1.Department of Materials ScienceCalifornia Institute of TechnologyPasadenaUSA
  2. 2.Department of Mechanical EngineeringTsinghua UniversityBeijingChina
  3. 3.Key Laboratory for Advanced Materials Processing TechnologyMinistry of EducationBeijingChina
  4. 4.Institute of PhysicsAcademia SinicaTaipeiTaiwan

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