Characterization of the cure shrinkage, reaction kinetics, bulk modulus and thermal conductivity of thermoset resin from a single experiment


The use of thermoset composites has increased remarkably during the recent past in naval, automobile and aeronautical applications. Despite superior mechanical behaviour, certain problems, e.g. shape distortion, fibre buckling and matrix cracking, are induced in composite part, especially during fabrication due to the heterogeneous nature of such materials. Excellent control of the curing process is required for production of a composite part with required shape and properties. For an accurate simulation of the curing process, exact knowledge of cure-dependent polymer properties and heat transfer is needed. Several instruments are required to identify these parameters, which is time consuming, and costly. In the present study, results on the simultaneous characterization of bulk modulus, chemical shrinkage and degree of cure of vinylester resin using PVT-α device are presented. Determination of cure and temperature-dependent thermal conductivity of the matrix using the same device is also discussed. The obtained results are compared with the available literature results.

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Correspondence to Yasir Nawab or Frédéric Jacquemin.

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Nawab, Y., Casari, P., Boyard, N. et al. Characterization of the cure shrinkage, reaction kinetics, bulk modulus and thermal conductivity of thermoset resin from a single experiment. J Mater Sci 48, 2394–2403 (2013).

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  • Bulk Modulus
  • Heat Flux Density
  • Electromagnetic Acoustic Transducer
  • Heat Flux Sensor
  • Chemical Shrinkage