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Fluorinated polyimide–silica films with low permittivity and low dielectric loss

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Abstract

A sol–gel process was used to prepare polyimide–silica hybrid films from the fluorinated polyimide precursors (6FDA-ODA) and tetraethylorthosilicate (TEOS) in N,N-dimethyl acetamide. The hybrid film was then treated with hydrofluoric acid to remove the dispersed silica particles, leaving inside the film pores with diameters ranged from 80 nm to 1 μm, which depended on the size of the silica particles. The chemical structures and morphology of the hybrid and porous films were characterized by Fourier transform infrared spectroscopy and scanning electron microscopy, respectively. The synthesized porous fluorinated polyimide films show low relative dielectric permittivity of 1.9, rendering them promising for microelectronic packaging materials.

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Acknowledgements

This study was supported by the Key Project of Chinese Ministry of Education (No:107023), Special fund of Co-construction of Beijing Education Committee, The Hong Kong Polytechnic University Postdoctoral Fellowship Scheme (G-YX70).

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Authors and Affiliations

  1. State Key Laboratory of Geological Processes & Mineral Resources, National Laboratory of Mineral Materials, School of Materials Science and Technology, China University of Geosciences (Beijing), Beijing, 100083, People’s Republic of China

    Yihe Zhang, Li Yu, Qingsong Su & Hong Zheng

  2. Department of Applied Physics and Materials Research Centre, The Hong Kong Polytechnic University, Hong Kong, People’s Republic of China

    Haitao Huang & H. L. W. Chan

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  1. Yihe Zhang
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  2. Li Yu
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  3. Qingsong Su
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  4. Hong Zheng
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  5. Haitao Huang
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  6. H. L. W. Chan
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Correspondence to Yihe Zhang or Haitao Huang.

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Zhang, Y., Yu, L., Su, Q. et al. Fluorinated polyimide–silica films with low permittivity and low dielectric loss. J Mater Sci 47, 1958–1963 (2012). https://doi.org/10.1007/s10853-011-5990-x

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  • DOI: https://doi.org/10.1007/s10853-011-5990-x

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