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Synthesis and electrical properties of uniform silver nanoparticles for electronic applications

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Abstract

Silver nanoparticles are considered to apply a silver paste for electrode because of their high conductivity. However, the dispersion of silver nanoparticles in electronically conductive adhesives (ECAs) restricts them used as conductive fillers. A simple method had enabled the synthesis of silver nanoparticles by reducing silver nitrate with ethanol in the presence of poly(N-vinylpyrrolidone) (PVP). Reaction conditions, such as silver nitrate concentration, PVP concentration, reaction time, and reaction temperature, had been studied. Fine dispersion and narrow size distribution of silver nanoparticles were obtained. They were added to ECAs by re-dispersing them in ethanol while it was used as the diluent to adjust the volatility of ECAs, preventing them from the aggregation and increasing the chance to fill the gaps between silver flakes. This proposed process offers the possibility to effectively use these synthesized silver nanoparticles for improving the conductivity of ECAs.

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Acknowledgements

The authors would like to thank Analytical and Testing Center, Huazhong University of Science and Technology, P.R. China, for the test of TEM images. The authors wish to thank Dr. Changle Wu and Dr. Wei Wang for discussions and their valuable advices.

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Authors and Affiliations

  1. State Key Laboratory of Plastic Forming Simulation and Die and Mould Technology, Huazhong University of Science and Technology, Wuhan, Hubei, 430074, People’s Republic of China

    Dapeng Chen, Xueliang Qiao & Jianguo Chen

  2. Nanomaterials Research Center, Nanchang Institute of Technology, Nanchang, Jiangxi, 330013, People’s Republic of China

    Xiaolin Qiu

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  1. Dapeng Chen
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  2. Xueliang Qiao
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  3. Xiaolin Qiu
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  4. Jianguo Chen
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Correspondence to Xueliang Qiao.

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Chen, D., Qiao, X., Qiu, X. et al. Synthesis and electrical properties of uniform silver nanoparticles for electronic applications. J Mater Sci 44, 1076–1081 (2009). https://doi.org/10.1007/s10853-008-3204-y

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  • DOI: https://doi.org/10.1007/s10853-008-3204-y

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