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Dynamic wetting and heat transfer at the initiation of aluminum solidification on copper substrates

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Abstract

Dynamic wetting and heat transfer during the start of solidification were studied with the help of molten aluminum droplets falling from a crucible onto a copper substrate. A high-speed camera captured the change in the spreading droplet’s geometry, while thermocouple, inserted inside the substrate, allowed a heat transfer analysis to be performed. Droplet spreading factors and interfacial heat fluxes were then used to, respectively, characterize dynamic wetting and heat transfer for the various experimental conditions explored. These were: (1) effects of chemical composition of the aluminum alloy, (2) initial temperature of the substrate, (3) surface roughness of the substrate, and (4) composition of the gaseous atmosphere. The experiments were all carried out in gaseous atmospheres containing oxygen in sufficient amount to form oxide skins at the surface of the droplets and the substrates. The results showed instances where an improvement in the dynamic wetting was accompanied by an increase in heat transfer during the early stages of solidification but this was not systematic. In these cases where a positive correlation was not observed, it was postulated this was caused by factors such as variations in the oxidation at the surface of the substrates and the droplets as well as gas trapped at the interface between the droplets and the substrates.

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Abbreviations

C :

Heat capacity (kJ kg−1 K−1)

d :

Droplet diameter (m)

E K :

Kinetic energy (J)

E surf :

Surface energy (J)

h :

Height of fall (m)

i :

Node identification in the numerical analysis

J :

Total number of thermocouples

k :

Thermal conductivity (W m−1 K−1)

m :

Number of time intervals for inverse calculations or droplet mass (kg)

n :

Iteration number in Eqs. 6 and 7

N :

Total number of nodes

q :

Interfacial heat flux per unit area (W m−2)

t :

Time (s)

T :

Temperature (K)

T o :

Initial temperature (K)

r :

Number of future time-steps

v :

Velocity (m/s)

We :

Weber number

x :

Length (m)

Y :

Measured temperatures (K)

Z :

Sensitivity coefficient (W K m−2)

δ:

Incremental heat flux factor

γ:

Surface tension (N m−1)

θ:

Contact angle

ρ:

Density (kg m−3)

σ:

Surface energy (J m−2)

ξ:

Spreading factor

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Acknowledgements

Technical assistance from Daniel Simard, Christian Corbeil, Hugues Blanchette. Geneviève Simard, Hélène Grégoire, and Marie-Ève Larouche from the Aluminum Technology Center are acknowledged. The authors would also like to thank Centre québécois de recherche et de développement de l’aluminium (CQRDA) and Fond québécois de la recherche sur la nature et les technologies (FQRNT) for their financial support.

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Authors and Affiliations

  1. Aluminum Technology Centre, National Research Council, Canada, 501 boul. de l’Université, Chicoutimi, Québec, Canada, G7H 8C3

    Dominique Bouchard & Jean-Paul Nadeau

  2. Arvida Research and Development Centre, Rio Tinto Alcan Inc, 1950 Mellon Blvd, P.O. Box 1250, Jonquière, Québec, Canada, G7S 4K8

    Sébastien Leboeuf

  3. McGill Metals Processing Centre, McGill University, 3610 University Street, M.H. Wong Building, Montréal, Québec, Canada, H3A 2B2

    Roderick I. L. Guthrie & Mihaiela Isac

Authors
  1. Dominique Bouchard
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  2. Sébastien Leboeuf
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  3. Jean-Paul Nadeau
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  4. Roderick I. L. Guthrie
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  5. Mihaiela Isac
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Corresponding author

Correspondence to Dominique Bouchard.

Additional information

Sébastien Leboeuf formerly with the Aluminum Technology Centre and McGill University.

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Bouchard, D., Leboeuf, S., Nadeau, JP. et al. Dynamic wetting and heat transfer at the initiation of aluminum solidification on copper substrates. J Mater Sci 44, 1923–1933 (2009). https://doi.org/10.1007/s10853-008-2888-3

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