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Journal of Materials Science

, Volume 42, Issue 13, pp 4757–4762 | Cite as

α Transition of polyamide 6 in chemically bonded polyamide 6/polytetrafluoroethylene compounds studied by dynamic mechanical thermal analysis and dielectric thermal analysis

  • Jun ZhaoEmail author
Article

Abstract

The α transition of polyamide 6 (PA 6) component in chemically bonded PA 6/polytetrafluoroethylene (PTFE) compounds is studied by dynamic mechanical thermal analysis (DMTA) and dielectric thermal analysis (DETA). It is found that DMTA shows better compatibility between two components than DETA does. It is also found that at the α transition temperature of PA 6 component (T α PA 6 ), the dynamic mechanical response of PTFE component is remarkable while its dielectric response is negligible. The effect of PTFE component on the segmental mobility of PA 6 component is discussed on the basis of DMTA, DETA and differential scanning calorimetry (DSC) results and the chemical bonding effect is found to play the dominant role. The measurement of apparent activation energy (ΔE a) shows that the addition of PTFE component reduces the cooperativity of the α transition of PA 6 component.

Keywords

Differential Scanning Calorimetry PTFE DETA Dynamic Mechanical Thermal Analysis Interfacial Polarization 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgements

The financial support from the Joint Program between Max Planck Society (MPG) and Chinese Academy of Sciences (CAS) is appreciated. The author would also like to thank Dr. D. Lehmann (Institute for Polymer Research, Dresden, Germany) for providing the samples.

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Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  1. 1.Max Planck Institute for Polymer ResearchMainzGermany

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