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Epoxy-imide resins from N-(4-carboxyphenyl)trimellitimide: effect of imide and aromatic content on adhesive and thermal properties

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Abstract

The effect of imide and aromatic content on the adhesive and thermal properties of epoxy-imide resins obtained through the reaction of epoxy resins viz., Araldite GY 250 (DGEBA; difunctional), Araldite EPN 1138 (novolac; polyfunctional) and epoxidized hydroxyl-terminated polybutadiene (EHTPB) with an imide-diacid viz., N-(4-carboxyphenyl)trimellitimide (IDA-I) was studied for different carboxyl equivalent to epoxy equivalent ratios (C/E ratios). The glass transition temperature of epoxy-imides varies from 80 to 144 °C, 120 to 184 °C and 41 to 143 °C for GY 250-IDA-I, EPN 1138-IDA-I and EHTPB-IDA-I respectively with the variation in C/E ratio from 0.5 to 2. For C/E ratio up to 1, the overall thermal stability of epoxy-imides follow the trend, EPN 1138-IDA-I > GY 250-IDA-I > EHTPB-IDA-I and above this ratio considerable improvement in overall thermal stability is observed only for EHTPB-IDA-I. The optimum C/E ratio for obtaining maximum room temperature and elevated temperature adhesive strength was found to be 1.25. For the optimum ratio, GY 250, EPN 1138 and EHTPB-based systems give adhesive strength of 29, 23 and 18 MPa respectively at room temperature and retain 78.3, 56.2 and 44.4% of the room temperature adhesive strength at 150 °C. The influence of C/E ratio or in otherwords, imide or aromatic content on the adhesive strength, thermal stability and glass transition temperature was more pronounced for aliphatic epoxy, i.e., EHTPB-based system.

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Acknowledgements

The authors are thankful to the Director, Vikram Sarabhai Space Centre (VSSC) for granting permission to publish this work. Thanks are due to Mr. K. S. Sastri and Dr. K. N. Ninan for encouragement. Help received from the members of the Analytical and Spectroscopy Division, VSSC for the thermal and spectral analysis of the samples is gratefully acknowledged. The authors also thank the reviewer for valuable comments. One of the authors (G.A.) is thankful to UGC, New Delhi for granting her a Fellowship.

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Author notes

  1. Ginu Abraham

    Present address: The Centre for Advanced Macromolecular Design (CAMD), School of Chemical Sciences and Engineering, Kensington, Sydney, NSW, 2052, Australia

  2. Sugu Surya Bhagawan

    Present address: Department of Polymer Engineering, Amritha School of Engineering, Ettimadai, Coimbatore, 641105, India

Authors and Affiliations

  1. Polymers and Special Chemicals Division, Propellant and Special Chemicals Group, PCM Entity, Vikram Sarabhai Space Centre, Thiruvananthapuram, 695022, India

    Ginu Abraham, Shanmugam Packirisamy & Rajagopala Iyer Ramaswamy

  2. Propellant Engineering Division, Propellant and Special Chemicals Group, PCM Entity, Vikram Sarabhai Space Centre, Thiruvananthapuram, 695022, India

    Sugu Surya Bhagawan & Ganapathy Balasubramanian

Authors
  1. Ginu Abraham
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  2. Shanmugam Packirisamy
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  3. Sugu Surya Bhagawan
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  4. Ganapathy Balasubramanian
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  5. Rajagopala Iyer Ramaswamy
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Correspondence to Ginu Abraham.

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Abraham, G., Packirisamy, S., Bhagawan, S. et al. Epoxy-imide resins from N-(4-carboxyphenyl)trimellitimide: effect of imide and aromatic content on adhesive and thermal properties. J Mater Sci 42, 8342–8349 (2007). https://doi.org/10.1007/s10853-006-0547-0

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  • DOI: https://doi.org/10.1007/s10853-006-0547-0

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