References
G. Palumbo, S. J. Thorpe and K. T. Aust, Scripta Metall. 24 (1990) 1347.
X. Y. Wang and D. Y. Li, Electrochimica Acta 47 (2002) 3939.
J. E. Sweitzer, G. J. Shiflet and J. R. Scully, Electrochimica Acta 48 (2003) 1223.
L. C. Wang and D. Y. Li, Surf. Coatings Technol. 167 (2003) 188.
S. J. Thorpe, B.Ramaswami and K. T. Aust, J. Electrochem. Soc. 135 (1988) 2162.
R. B. Inturi and Z. Szklarska-Smialowska, Corrosion 48 (1992) 398.
G. Chen and H. Lou, Nanostruct. Mater. 11 (1999) 637.
A. Barbucci, G. Farne, P. Matteazzi, R. Riccieri and G. Cerisola, Corr. Sci. 41 (1999) 463.
R. Rofagha, R.Langer, A. M. El-Sheril, U.Erb, G.Palumbo, and K. T. Aust, Scripta Metall. 25 (1991) 2867.
L. LU, N. R. TAO, L. B. WANG, B. Z. DING and K. LU, J. Appl. Phys. 89 (2001) 6408.
P. Mulvaney, in Nanoscale materials in Chemistry, edited by K. J. Klabunde (Wiley, 2001) pp. 121.
F. J. Cornwell, Brit. Corr. J. 8 (1973) 202.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Yu, J.K., Han, E.H., Lu, L. et al. Corrosion behaviors of nanocrystalline and conventional polycrystalline copper. J Mater Sci 40, 1019–1022 (2005). https://doi.org/10.1007/s10853-005-6524-1
Received:
Accepted:
Issue Date:
DOI: https://doi.org/10.1007/s10853-005-6524-1