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The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers

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References

  1. R. KLEHN and T. W EAGAR, WRC Bulletin. 385 (1993) 1.

  2. Z. LI, W. FEARIS and T. H. NORTH, Mater. Sci. Technol. 11 (1995) 363.

  3. Z. LI, Y. ZHOU and T. H. NORTH, J. Mater. Sci. 30 (1995) 1075.

  4. A. A. SHIRZADI and E. R.WALLACH, Mater. Sci. Technol. 13 (1997) 135.

  5. J. R. ASKEW, J. F. WILDE and T. I. KHAN, Mater. Sci. Technol. 14 (1998) 920.

  6. X. P. ZHANG, L. YE, Y. W. MAI, G. F. QUAN and W. WEI, Composites: Part A. 30 (1999) 1415.

  7. P. G. PARTRIDGE and D. V. DUNFORD, J. Mater. Sci. 26 (1991) 2255.

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Authors and Affiliations

  1. State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin, 150001, People's Republic of China

    Yan Jiuchun, Xu Zhiwu, Wu Gaohui & Yang Shiqin

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  1. Yan Jiuchun
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  2. Xu Zhiwu
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  3. Wu Gaohui
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  4. Yang Shiqin
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Correspondence to Yan Jiuchun.

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Jiuchun, Y., Zhiwu, X., Gaohui, W. et al. The evolution of interface structure in TLP bonded joints of Al2O3p/6061Al composites with Cu/Ni/Cu interlayers. J Mater Sci 40, 5307–5309 (2005). https://doi.org/10.1007/s10853-005-4394-1

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  • DOI: https://doi.org/10.1007/s10853-005-4394-1

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