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Sequential deposition of copper/alumina composites

Journal of Materials Science volume 40, pages 3293–3295 (2005)Cite this article

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Authors and Affiliations

  1. Mechanical Engineering Department, San Diego State University, 5500 Campanile Drive, San Diego, CA, 92182-1323, USA

    X. Wang, J. Ma, A. Maximenko & E. A. Olevsky

  2. SUN Microsystems, CTO Physical Sciences Center, San Diego, CA, 92121, USA

    M. B. Stern & B. M. Guenin

Authors
  1. X. Wang
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  2. J. Ma
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  3. A. Maximenko
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  4. E. A. Olevsky
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  5. M. B. Stern
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  6. B. M. Guenin
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Corresponding author

Correspondence to E. A. Olevsky.

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Wang, X., Ma, J., Maximenko, A. et al. Sequential deposition of copper/alumina composites. J Mater Sci 40, 3293–3295 (2005). https://doi.org/10.1007/s10853-005-2704-2

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  • DOI: https://doi.org/10.1007/s10853-005-2704-2

Keywords

  • Polymer
  • Sequential Deposition