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Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

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References

  1. T. OHOKA, Y. NAKAMURA and T.ONO, J. Mater. Sci 39 (2004) 4379.

    Article  Google Scholar 

  2. B. M. DRAPKIN, A. A. BIRFEL’D, V. K. KONONEKO and YU. N. KALYUKIN, Phys. Met. Metal 49 (1980) 150.

    Google Scholar 

  3. V. S. POSTNIKOV, I. M. SHARSHAKOV and E. M. MASLENNIKOV, Metallurgiya (1963) 165.

  4. L. ROTHERHAM, A. D. N. SMITH and G. B. GREENNOUGH, J. Inst. Met 79 (1951) 439.

    Google Scholar 

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Authors and Affiliations

  1. Department of Mechanical and Systems Engineering, Faculty of Engineering, Gifu University, 1-1 Yanagido, Gifu-city, Gifu, 501-1193, Japan

    Y. Nakamura & T. Ono

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  1. Y. Nakamura
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  2. T. Ono
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Correspondence to T. Ono.

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Nakamura, Y., Ono, T. Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders. J Mater Sci 40, 3267–3269 (2005). https://doi.org/10.1007/s10853-005-2698-9

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  • DOI: https://doi.org/10.1007/s10853-005-2698-9

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