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A novel micro-scaled multi-layered optical stress sensor for force sensing

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Abstract

Miniaturization and integration of sensors on chip has become essential with advancements of artificial intelligence and the Internet of Thing. The size of existing microbend optical stress sensors is too large for integration on a chip, necessitating fundamental change of structural design to achieve micron-sized lithography. In this regard, we demonstrate the design and analysis of a multi-layer microbend optical stress sensor using an advanced Multiphysics simulation model that could be potentially embedded on chips after the experimental tests of the basic microbend optical stress sensor units. The sensor architecture is optimized not just in size, but also the materials in the layers. A well-optimized structure of Glass/Ag/SU8/PDMS architecture delivers best comprehensive performance resulting in a sensitivity in one pitch of 110.42 µm which is 0.00935 N−1 with a linearity of R2 = 0.99868 at a detectable range of 1200 N–2800 N. This work paves way for embedding microbend optical stress sensors on chips to further accelerate sensors for communication and information technologies.

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Data availability

The datasets generated during and/or analyzed during the current study are available from the corresponding author on reasonable request.

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Funding

The authors acknowledge the grant from the Research Grant Council of HKSAR (Grant No. CityU 11210819).

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Authors and Affiliations

  1. State Key Laboratory for Millimeter and Terahertz Waves and Department of Materials Science and Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong SAR, China

    Weijia Wang

  2. Department of Electronic and Electrical Engineering, University of Sheffield, Sheffield, S3 7HQ, UK

    Maria Merlyne De Souza

  3. James Watt School of Engineering, University of Glasgow, Glasgow, G12 8QQ, UK

    Rami Ghannam & Vellaisamy A. L. Roy

  4. Department of Mechanical Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong SAR, China

    Wen Jung Li

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Wang, W., De Souza, M.M., Ghannam, R. et al. A novel micro-scaled multi-layered optical stress sensor for force sensing. J Comput Electron 22, 768–782 (2023). https://doi.org/10.1007/s10825-023-02014-y

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