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Study of bimetallic corrosion related to Cu interconnects using micropattern corrosion screening method and Tafel plots

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Abstract

On-chip microscopic corrosion, originating from contact of dissimilar metals, can cause serious reliability issues for integrated circuits and microelectromechanical devices. A new micropattern corrosion screening method combined with Tafel plots were employed to study Cu bimetallic corrosion in acid and base solutions relevant to the chemical–mechanical planarization process. The results demonstrated that Cu corrosion on Ru is much more severe compared to Cu corrosion on Ta substrates. Tafel plots confirm the nobility trend of Ru > Cu > Ta. The micropattern corrosion study shows the Cu bimetallic corrosion depends on specific chemicals and bimetallic contacts. Strong complexing ligands like NH3 combined with energetically favorable Cu/Ru bimetallic contact promote faster Cu corrosion under alkaline conditions (9 ≤ pH ≤ 11.4). Micropattern corrosion screening was shown to be useful in identifying the metastable surface layer during Cu corrosion and determining the optimal benzotriazole concentration for Cu corrosion inhibition.

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References

  1. Spencer TJ, Osborn T, Kohl PA (2008) Science 320:756

    Article  CAS  Google Scholar 

  2. Osborn T, He A, Galiba N, Kohl PA (2008) J Electrochem Soc 155:308

    Article  Google Scholar 

  3. Banerjee G, Rhoades RL (2008) ECS Trans 13:1

    Article  CAS  Google Scholar 

  4. Armini S, Whelan CM, Moinpour M, Maex K (2009) J Electrochem Soc 156:18

    Article  Google Scholar 

  5. Park JG, Busnaina AA, Hong YK (2008) Microelectronic applications of chemical–mechanical planarization. Wiley, New York, p 467

  6. Doi TK (2007) Manuf Eng Mater Process 73:341

    CAS  Google Scholar 

  7. Melitta H, Frank WD, John TW, Martin K, Carlo C, Roya M (2008) Sens Actuators 145:323

    Article  Google Scholar 

  8. Kahn H, Avishai A, Ballarinib R, Heuera AH (2008) Scripta Mater 59:912

    Article  CAS  Google Scholar 

  9. Chyan O, Chen JJ, Liu M, Chen L, Xu F (1997) J Mater Res 12:3241

    Article  Google Scholar 

  10. Kim IK, Cho BG, Park JG, Park JY, Park HS (2009) J Electrochem Soc 156:188

    Article  Google Scholar 

  11. Chyan O, Arunagiri TN, Ponnuswamy T (2003) J Electrochem Soc 150:347

    Article  Google Scholar 

  12. Chan R, Arunagiri TN, Zhang Y, Chyan O, Wallace RM, Kim MJ, Hurd T (2004) Electrochem Solid State Lett 7:154

    Article  Google Scholar 

  13. Lane MW, Murray CE, McFeely FR, Vereecken PM, Rosenberg R (2003) Appl Phys Lett 83:2330

    Article  CAS  Google Scholar 

  14. Kim IK, Kang YJ, Kwon TY, Cho BG, Park JG, Park JY, Park HS (2008) Electrochem Solid State Lett 11:150

    Article  Google Scholar 

  15. Chyan O, JJ Chen, Xu F, Wu J (1997) Anal Chem 69:2434

    Article  CAS  Google Scholar 

  16. Pourbaix M (1975) Atlas of electrochemical equilibria aqueous solutions. HACE, Houston

  17. Gorantla VR, Goia D, Matijevic E, Babu SV (2005) J Electrochem Soc 152:912

    Article  Google Scholar 

  18. Dean JA (ed) (1985) Lange’s handbook of chemistry, 13th edn. McGraw Hill, New York, p 571

  19. Chen CW, Chen JS, Jeng JS (2008) J Electrochem Soc 155:1003

    Article  Google Scholar 

  20. Tsao JC, Liu CP, Wang YL, Chen KW (2008) J Nanosci Nanotechnol 8:2582

    Article  CAS  Google Scholar 

  21. Revie RW (ed) (2000) Uhilig’s corrosion handbook, 2nd edn. Wiley-Interscience, New York

    Google Scholar 

  22. Naghshineh S, Barnes J, Hashemi, Y, Oldak EB (2001) United States Patent 6194366

  23. Kim IK, Kang YJ, Hong YK, Park JG (2005) In: Materials Research Society symposium proceedings, pp 3–7

  24. Deshpande S, Kuiry SC, Klimov M, Seal S (2005) Electrochem Solid-State Lett 8:98

    Article  Google Scholar 

  25. Poling GW (1970) Corros Sci 10:359

    Article  CAS  Google Scholar 

  26. Thomas D (1998) J Electrochem Soc 145:42

    Article  Google Scholar 

Download references

Acknowledgments

The authors acknowledge the Robert A. Welch Foundation (B-1287) and Semiconductor Research Corporation (1292.042) for financial support. Helpful discussion from Trace Hurd, J.D. Luttmer, and Noel Russell toward this study is appreciated.

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Authors and Affiliations

  1. Department of Chemistry, University of North Texas, Denton, Texas, 76203, USA

    Kyle Kai-Hung Yu, Karthikeyan S. M. Pillai, Praveen R. Nalla & Oliver Chyan

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  1. Kyle Kai-Hung Yu
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  2. Karthikeyan S. M. Pillai
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  3. Praveen R. Nalla
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  4. Oliver Chyan
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Correspondence to Oliver Chyan.

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Yu, K.KH., Pillai, K.S.M., Nalla, P.R. et al. Study of bimetallic corrosion related to Cu interconnects using micropattern corrosion screening method and Tafel plots. J Appl Electrochem 40, 143–149 (2010). https://doi.org/10.1007/s10800-009-9990-3

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  • DOI: https://doi.org/10.1007/s10800-009-9990-3

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