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High speed platinum deposition from a sulphamate formulation

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Abstract

A sulphamate based bath was identified as being suitable for high-speed platinum plating. The bath offers current efficiency approaching 70–80% and the deposits are bright in appearance. SEM examination showed that the grains are fine and XRD analysis indicates their grain size to be at the nano level. Cyclic voltammetric studies of the deposits indicate increased surface area. The properties of deposits obtained from sulphate and sulphamate formulations are compared.

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Acknowledgements

The authors express their sincere thanks to the Director, Central Electrochemical Research Institute, Karaikudi, for permission to publish this paper.

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  1. Central Electrochemical Research Institute, Karaikudi, 630 006, TN, India

    Malathy Pushpavanam

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  1. Malathy Pushpavanam
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Correspondence to Malathy Pushpavanam.

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Pushpavanam, M. High speed platinum deposition from a sulphamate formulation. J Appl Electrochem 36, 1069–1074 (2006). https://doi.org/10.1007/s10800-006-9171-6

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  • DOI: https://doi.org/10.1007/s10800-006-9171-6

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