Abstract
The emerging ionic thermoelectric (i-TE) materials are promising for waste heat recovery and temperature sensors due to their huge ionic Seebeck coefficients. However, rare work concentrates on studying the intrinsic thermal conductivity of i-TE materials and the interfacial thermal conductance with electrodes, which could significantly affect the performance of i-TE-based devices. In this work, the thermal transport properties of polymer-based i-TE films at various temperatures were investigated by the time-domain thermoreflectance method. Interestingly, the thermal conductivity of the polymer i-TE films was found to decrease with increasing temperature, showing a similar temperature-dependent trend with crystalline materials. Moreover, the interfacial thermal conductance between i-TE films and the metal electrode is ~ 50 MW·m−2·K−1, which is related to the rotation speed during the spin-coating process. The above finding is important to optimize the performance of the i-TE devices in practical applications.
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Data Availability
The datasets generated during and analyzed during the current study are available from the corresponding author on reasonable request.
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Funding
This work was supported by the National Natural Science Foundation of China (Grant Nos. 52176078, 52106095), Tsinghua University Initiative Scientific Research Program, Tsinghua-Toyota Joint Research Fund and University Joint Innovation Fund of China Academy of Launch Vehicle Technology (No. 2022-29).
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YL and CC designed, performed the experiments, and analyzed the data. YZ characterized the samples by Raman spectroscopy. YD helped characterize the thermal properties of samples with TDTR. YL, CC and WM wrote and finalized the manuscript. WM and XZ supervised the project. All the authors contributed to the discussion and gave comments.
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Lu, Y., Chi, C., Zhang, Y. et al. Time-Domain Thermoreflectance Study of the Thermal Transport Properties of All-Solid-State Ionic Thermoelectric Material. Int J Thermophys 44, 88 (2023). https://doi.org/10.1007/s10765-023-03199-x
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DOI: https://doi.org/10.1007/s10765-023-03199-x