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Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique

  • Asian Thermophysical Properties Conference Paper
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Abstract

In this work, the study of photosensitive dry-type films by photoacoustic technique is proposed. The dry film photoresist is resistant to chemical etching for printed circuit boards such as ferric chloride, sodium persulfate or ammonium, hydrochloric acid. It is capable of faithfully reproducing circuit pattern exposed to ultraviolet light (UV) through a negative. Once recorded, the uncured portion is removed with alkaline solution. It is possible to obtain good results in surface mount circuits with tracks of 5 mm. Furthermore, the solid resin films are formed by three layers, two protective layers and a UV-sensitive optical absorption layer in the range of 325 nm to 405 nm. By means of optical absorption of UV–visible rays emitted by a low-power Xe lamp, the films transform this energy into thermal waves generated by the absorption of optical radiation and subsequently no-radiative de-excitation occurs. The photoacoustic spectroscopy is a useful technique to measure the transmittance and absorption directly. In this study, the optical absorption spectra of the three layers of photosensitive dry-type films were obtained as a function of the wavelength, in order to have a knowledge of the absorber layer and the protective layers. These analyses will give us the physical properties of the photosensitive film, which are very important in curing the dry film for applications in printed circuit boards.

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References

  1. V.N. Kuznetsov, N.F. Smimova, V.D. Karpov, Dry film multilayer photoresist element, U.S. Patent 4 318 975, 25 Dec 1978

  2. L.R. Wallig, Dry film photoresists, in ed. Bristol. The Multilayer Printed Circuit Board Handbook, Chapter V (Electrochemical Publications, 1995)

  3. S.S. Gi, A multilayer film for dry film resist, Patent WO 2009084929 A2, 31 Dec 2008

  4. J. Kimura, C. Ishikawa, Y. Tanaka, S. Takano, Y. Minami, Photosensitive film, U.S. Patent US 7 645 562, 12 Jan 2010

  5. C. Tsai, Unique Dry Film Photoresist System for TSV Via Formation/Protection/Plating, DuPont\(^{\textregistered }\) Corporation, 19 March 2008

  6. C.A. Mack, Absorption and exposure in positive photoresist. Appl. Opt. 27, 4913–4919 (1998)

    Article  ADS  Google Scholar 

  7. Dupont, DryFilm RA Dispersions, DuPont\(^{\textregistered }\) Corporation, Tech. Rep, H-97551-1 (2003)

  8. J.L. Jiménez-Pérez, J. Jiménez-Pérez, A. Bracamontes Cruz, A. Cruz-Orea, J.G. Mendoza-Alvarez, Photoacoustic analysis of pigments from archeological ceramics. Int. J. Thermophys. 25, 503–510 (2004)

    Article  ADS  Google Scholar 

  9. G. Bogoeva-Gaceva, A. Bužarovska, A rapid method for the evaluation of cure kinetics of thermosetting polymers. Maced. J. Chem. Chem. Eng. 32, 337–344 (2013)

    Article  Google Scholar 

  10. P.V. Pincel, J.L. Jiménez-Pérez, A. Cruz-Orea, Z.N. Correa-Pacheco, J.H. Rosas, Photoacoustic study of curing time by UV laser radiation of a photoresin with different thickness. Thermochim. Acta 606, 53–57 (2015)

    Article  Google Scholar 

  11. J.L. Jiménez-Pérez, P. Vieyra Pincel, A. Cruz-Orea, Z.N. Correa-Pacheco, Thermal characterization of a liquid resin for 3D printing using photothermal techniques. Appl. Phys. A 122, 556 (2016)

    Article  ADS  Google Scholar 

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Acknowledgements

Thanks to CONACYT, COFAA and CGPI-IPN, México, for their partial financial support. One of the authors (A. Cruz-Orea) is grateful for the financial support of CONACYT through Project 241330. Also, we thank Ing. Esther Ayala at the Physics Department of CINVESTAV-IPN for her technical support.

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Authors and Affiliations

  1. UPIITA, Instituto Politécnico Nacional, Avenida IPN, No. 2580, Col. Barrio la Laguna Ticomán, Gustavo A. Madero, C.P. 07340, Ciudad de México, Mexico

    R. Hernández, J. A. Barrientos Zaragoza & J. L. Jiménez-Pérez

  2. Departamento de Física, CINVESTAV-IPN, Av. Instituto Politécnico Nacional No. 2508, Col. San Pedro Zacatenco, C.P. 07360, Ciudad de México, Mexico

    A. Cruz Orea

  3. CEPROBI, Instituto Politécnico Nacional, Carretera Yautepec–Jojutla, km 6. San Isidro, C.P. 62731, Yautepec, Morelos, Mexico

    Z. N. Correa-Pacheco

Authors
  1. R. Hernández
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  2. J. A. Barrientos Zaragoza
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  3. J. L. Jiménez-Pérez
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  4. A. Cruz Orea
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  5. Z. N. Correa-Pacheco
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Corresponding author

Correspondence to J. L. Jiménez-Pérez.

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Selected paper from Asian Thermophysical Properties Conference.

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Hernández, R., Zaragoza, J.A.B., Jiménez-Pérez, J.L. et al. Study of Photosensitive Dry Films Absorption for Printed Circuit Boards by Photoacoustic Technique. Int J Thermophys 38, 114 (2017). https://doi.org/10.1007/s10765-017-2247-1

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  • DOI: https://doi.org/10.1007/s10765-017-2247-1

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